Search Results - "ANDREAS GRASSMANN" :: K.UTB vyhledávací portál

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Kunststoffkühler für Halbleitermodule

by Yoo, Inpil, Grassmann, Andreas
Year of Publication 08.09.2016

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Semiconductor circuit arrangement comprises a thin carrier substrate containing semiconductor components, a galvanic seed layer, a galvanic filler material galvanically formed on the seed layer and a material resistant to shearing stress

by GRASSMANN, ANDREAS
Year of Publication 13.01.2005

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Control of critical dimensions

by GRASSMANN, ANDREAS
Year of Publication 27.10.2004

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Method for forming contact holes

by ANDREAS GRASSMANN
Year of Publication 19.05.2004

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Leadframe, gekapseltes Package mit gestanzter Leitung und gesägten Seitenflanken, und entsprechendes Herstellungsverfahren

by Schindler, Uwe, Singer, Frank, Gruber, Martin, Grassmann, Andreas, Boehm, Marcus
Year of Publication 22.07.2021

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Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method

by SINGER FRANK, SCHINDLER UWE, GRASSMANN ANDREAS, GRUBER MARTIN, BOEHM MARCUS
Year of Publication 20.07.2021

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Package with interconnections having different melting temperatures

by HOEGERL JURGEN, KESSLER ARND, GRASSMANN ANDREAS, NIKITIN IVAN
Year of Publication 09.07.2021

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Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

by KESSLER Angela, NIKITIN Ivan, GRASSMANN Andreas, STRASS Achim, HOEGERL Juergen, HABLE Wolfram
Year of Publication 12.04.2018

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Leistungshalbleitermodul

by GRASSMANN, ANDREAS, AUSSERLECHNER, UDO
Year of Publication 14.01.2016

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Method of producing of a break-proof plate-like object, and corresponding semiconductor circuit

by GRASSMANN, ANDREAS
Year of Publication 29.02.2012

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ELECTRONIC SWITCHING ELEMENT AND INTEGRATED SENSOR

by ANDREAS GRASSMANN, WOLFGANG ROESNER, GERNOT LANGGUTH, STEFAN WILLKOFER
Year of Publication 27.01.2016

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ELECTRONIC SWITCHING ELEMENT AND INTEGRATED SENSOR

by ROESNER WOLFGANG, LANGGUTH GERNOT, GRASSMANN ANDREAS, WILLKOFER STEFAN
Year of Publication 14.01.2016

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Batchherstellung von Packages durch eine in Träger getrennte Schicht nach Anbringung von elektronischen Komponenten

by Scharf, Thorsten, Behrens, Thomas, Gruber, Martin, Grassmann, Andreas, Meyer, Thorsten
Year of Publication 19.11.2020

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BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTER MOUNTING OF ELECTRONIC COMPONENTS

by MEYER THORSTEN, SCHARF THORSTEN, GRASSMANN ANDREAS, GRUBER MARTIN, BEHRENS THOMAS
Year of Publication 17.11.2020

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Inverter mit Wärmeleitungsschnittstelle-Material und Hybridfahrzeug, auf welchen derselbe angewendet ist

by Lee, Hyun-Koo, Grassmann, Andreas
Year of Publication 06.04.2017

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Power semiconductor module and method for manufacturing the same

by ANDREAS GRASSMANN, SON, JEONG-MIN
Year of Publication 08.03.2017

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Leistungshalbleitermodul und Verfahren zum Herstellen desselben

by Grassmann, Andreas, Son, Jeong-Min
Year of Publication 02.03.2017

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Electronic module and method of manufacturing the same

by Winter Frank, Yoo Inpil, Geitner Ottmar, Neugirg Christian, Hable Wolfram, Schwarz Alexander, Grassmann Andreas
Year of Publication 01.06.2017

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Power semiconductor module and method for producing power semiconductor module

by UHLEMANN ANDRE, AHLERS DIRK, GRASSMANN ANDREAS, NIKITIN IVAN
Year of Publication 19.06.2020

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Leistungshalbleitermodul und Verfahren zum Herstellen eines Leistungshalbleitermoduls

by Nikitin, Ivan, Uhlemann, Andre, Grassmann, Andreas, Ahlers, Dirk
Year of Publication 18.06.2020

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