HEATER, REFLOW APPARATUS, AND SOLDER BUMP FORMING METHOD AND APPARATUS
FURUNO, MASAHIKO, SAITO, HIROSHI, ANDO, HARUHIKO, HIRATSUKA, ATSUSHI, ONOZAKI, JUNICHI, SAKAMOTO, ISAO, SHIRAI, MASARU
Year of Publication 17.11.2005
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Year of Publication 17.11.2005
Patent
HEATER, REFLOW APPARATUS, AND SOLDER BUMP FORMING METHOD AND APPARATUS
FURUNO, MASAHIKO, SAITO, HIROSHI, ANDO, HARUHIKO, HIRATSUKA, ATSUSHI, ONOZAKI, JUNICHI, SAKAMOTO, ISAO, SHIRAI, MASARU
Year of Publication 13.10.2005
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Year of Publication 13.10.2005
Patent