High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization
Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan
Published in Journal of alloys and compounds (30.11.2006)
Published in Journal of alloys and compounds (30.11.2006)
Get full text
Journal Article
Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint
Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan
Published in Soldering & surface mount technology (01.04.2006)
Published in Soldering & surface mount technology (01.04.2006)
Get full text
Journal Article
Conference Proceeding
Symmetrical Large-Signal Modeling of Microwave Switch FETs
Prasad, Ankur, Fager, Christian, Thorsell, Mattias, Andersson, Christer M., Yhland, Klas
Published in IEEE transactions on microwave theory and techniques (01.08.2014)
Published in IEEE transactions on microwave theory and techniques (01.08.2014)
Get full text
Journal Article
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Andersson, C., Lai, Z., Liu, J., Jiang, H., Yu, Y.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.03.2005)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.03.2005)
Get full text
Journal Article
Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan
Published in Materials science & engineering. B, Solid-state materials for advanced technology (25.11.2006)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (25.11.2006)
Get full text
Journal Article
Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan
Published in Journal of alloys and compounds (28.06.2007)
Published in Journal of alloys and compounds (28.06.2007)
Get full text
Journal Article
Symmetrical Modeling of GaN HEMTS
Prasad, Ankur, Fager, Christian, Thorsell, Mattias, Andersson, Christer M., Yhland, Klas
Published in 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2014)
Published in 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2014)
Get full text
Conference Proceeding
Selected papers from HDP'07
Liu, Johan, Lu, Daoqiang, Andersson, Cristina
Published in Soldering & surface mount technology (10.04.2009)
Published in Soldering & surface mount technology (10.04.2009)
Get full text
Journal Article
Selected papers from HDP07
Liu, Johan, Lu, Daoqiang, Andersson, Cristina
Published in Soldering & surface mount technology (10.04.2009)
Published in Soldering & surface mount technology (10.04.2009)
Get full text
Journal Article
Design of 50–70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate
Zhang, Xia, Kuylenstierna, Dan, Liu, Johan, Cai, Peng, Andersson, Cristina, Morris, James, Zirath, Herbert
Published in Journal of Infrared, Millimeter, and Terahertz Waves (01.02.2009)
Published in Journal of Infrared, Millimeter, and Terahertz Waves (01.02.2009)
Get full text
Journal Article
High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization
Sun, Peng, Andersson, Cristina, Wei, Xi-cheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan
Published in Journal of alloys and compounds (2006)
Published in Journal of alloys and compounds (2006)
Get full text
Journal Article
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
Zou, C.D, Gao, Y.L, Yang, B, Zhai, Q.J, Andersson, C, Liu, J
Published in Soldering & surface mount technology (01.01.2009)
Published in Soldering & surface mount technology (01.01.2009)
Get full text
Journal Article
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
Andersson, C, Vandevelde, B, Noritake, C, Sun, P, Tegehall, P.E, Andersson, D.R, Wetter, G, Liu, J
Published in Soldering & surface mount technology (01.01.2009)
Published in Soldering & surface mount technology (01.01.2009)
Get full text
Journal Article
Conference Proceeding