Through Silicon Via technology using tungsten metallization
Pares, G, Bresson, N, Minoret, S, Lapras, V, Brianceau, P, Lugand, J F, Anciant, R, Sillon, N
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
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Conference Proceeding
Dynamic control of an accelerometer bandwidth through tunable damping factor and effective moment of inertia
Fain, B., Souchon, F., Berthelot, A., Anciant, R, Robert, P., Jourdan, G.
Published in 2018 IEEE Micro Electro Mechanical Systems (MEMS) (01.01.2018)
Published in 2018 IEEE Micro Electro Mechanical Systems (MEMS) (01.01.2018)
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Conference Proceeding
Simulation of Writing and Erasing Processes of GeSbTe and GeSbTeSn with GeN Interlayers in the Case of Dual-Level DVR Discs
Hyot, B., Poupinet, L., Papon, A. M., Armand, M. F., Rolland, B., Marty, J., Fargeix, A., Lartigue, O., Lagrange, A., Anciant, R., Hofmann, H., Knappmann, S., Knittel, J., Richter, H.
Published in Japanese Journal of Applied Physics (2003)
Published in Japanese Journal of Applied Physics (2003)
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Journal Article
Bias Contributions in a MEMS Tuning Fork Gyroscope
Walther, A., Le Blanc, C., Delorme, N., Deimerly, Y., Anciant, R., Willemin, J.
Published in Journal of microelectromechanical systems (01.04.2013)
Published in Journal of microelectromechanical systems (01.04.2013)
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Journal Article
Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications
Charbonnier, J, Hida, R, Henry, D, Cheramy, S, Chausse, P, Neyret, M, Hajji, O, Garnier, G, Brunet-Manquat, C, Haumesser, P H, Vandroux, L, Anciant, R, Sillon, N, Farcy, A, Rousseau, M, Cuzzocrea, J, Druais, G, Saugier, E
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Inorganic technology for optical data storage
Perrier, R., Poupinet, L., Armand, M.F., Anciant, R., Lartigue, O., Bruneau, J.M.
Published in International Symposium on Optical Memory and Optical Data Storage Topical Meeting (2002)
Published in International Symposium on Optical Memory and Optical Data Storage Topical Meeting (2002)
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Conference Proceeding
Advantage of pseudo-binary PhaseChange material against eutectic material for application in poor rapid cooling structure
Fargeix, A., Hyot, B., Rolland, B., Poupinet, L., Armand, M.F., Anciant, R.
Published in International Symposium on Optical Memory and Optical Data Storage Topical Meeting (2002)
Published in International Symposium on Optical Memory and Optical Data Storage Topical Meeting (2002)
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Conference Proceeding
Simulation of the writing and erasing processes of GeSbTe and GeSbTeSn with GeN interlayers in the case of dual level DVR discs
Hyot, B., Poupinet, L., Armand, M.F., Rolland, B., Marty, J., Fargeix, A., Lartigue, O., Lagrange, A., Anciant, R., Hofmann, H., Knappman, S., Knittel, J., Richter, H.
Published in International Symposium on Optical Memory and Optical Data Storage Topical Meeting (2002)
Published in International Symposium on Optical Memory and Optical Data Storage Topical Meeting (2002)
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Conference Proceeding
Suppression of the resonance of vacuum-sealed accelerometers: A comparison of two different strategies
Fain, B., Souchon, F., Berthelot, A., Anciant, R., Robert, P., Jourdan, G.
Published in 2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) (01.03.2018)
Published in 2018 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) (01.03.2018)
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Conference Proceeding
Investigation of copper-tin transient liquid phase bonding reliability for 3D integration
Garnier, A., Gremion, C., Franiatte, R., Bouchu, D., Anciant, R., Cheramy, S.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Aluminum to Aluminum bonding at room temperature
Marion, F., de Brugiere, B. Goubault, Bedoin, A., Volpert, M., Berger, F., Gueugnot, A., Anciant, R., Ribot, H.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Dual-Level Inorganic Write-Once Blu-Ray Disc
Perrier, Robin, Anciant, Romain, Armand, Marie-Françoise, Lee, Yann
Published in Japanese Journal of Applied Physics (2003)
Published in Japanese Journal of Applied Physics (2003)
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Journal Article
Reliability tests on micro-insert die bonding technology
Nowodzinski, A., Boutry, H., Franiatte, R., Mandrillon, V., Anciant, R., Verrun, S., Simon, G.
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
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Conference Proceeding
Process and RF modelling of TSV last approach for 3D RF interposer
Fuchs, C., Brunet-Manquat, C., Diaz, J., Anciant, R., Vincent, P., Sillon, N., Ancey, P., Charbonnier, J., Cheramy, S., Cadix, L., Henry, D., Chausse, P., Hajji, O., Farcy, A., Garnier, G.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
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Conference Proceeding
Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack
Brocard, M., Le Maitre, P., Bermond, C., Bar, P., Anciant, R., Farcy, A., Lacrevaz, T., Leduc, P., Coudrain, P., Hotellier, N., Ben Jamaa, H., Cheramy, S., Sillon, N., Marin, J., Flechet, B.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Ultra low cost wafer level via filling and interconnection using conductive polymer
Saint-Patrice, D., Jacquet, F., Bridoux, C., Bolis, S., Anciant, R., Pouydebasque, A., Sillon, N., Vigier-Blanc, E.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results
Henry, D., Charbonnier, J., Chausse, P., Jacquet, F., Aventurier, B., Brunet-Manquat, C., Lapras, V., Anciant, R., Sillon, N., Dunne, B., Hotellier, N., Michailos, J.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs
Cadix, L., Rousseau, M., Fuchs, C., Leduc, P., Thuaire, A., El Farhane, R., Chaabouni, H., Anciant, R., Huguenin, J.-L., Coudrain, P., Farcy, A., Bermond, C., Sillon, N., Flechet, B., Ancey, P.
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding