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"ALVARADO, Reynante Tamunan"
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"ALVARADO, Reynante Tamunan"
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열 확산기로서 구성된 와이어 본드들을 포함하는 패키지
by
YIN WEN
,
ALVARADO REYNANTE TAMUNAN
,
AN YONGHAO
Year of Publication
03.04.2023
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인터커넥트 구조체를 갖는 3D 컴포넌트를 내장하기 위한 시스템, 장치, 및 방법
by
RAE DAVID FRASER
,
ALVARADO REYNANTE TAMUNAN
,
KESER LIZABETH ANN
Year of Publication
30.01.2018
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Package comprising wire bonds configured as a heat spreader
by
An, Yonghao
,
Yin, Wen
,
Alvarado
,
Reynante Tamunan
Year of Publication
03.01.2023
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PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
by
AN, Yonghao
,
ALVARADO
,
Reynante Tamunan
,
YIN, Wen
Year of Publication
07.06.2023
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PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
by
AN, Yonghao
,
ALVARADO
,
Reynante Tamunan
,
YIN, Wen
Year of Publication
03.02.2022
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PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
by
AN, Yonghao
,
ALVARADO
,
Reynante Tamunan
,
YIN, Wen
Year of Publication
03.02.2022
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SEMICONDUCTOR DEVICE COMPRISING MOLDING LAYER FOR TOP SIDE AND SIDEWALL PROTECTION
by
KESER, Lizabeth Ann
,
ALVARADO
,
Reynante Tamunan
,
XU, Jianwen
Year of Publication
01.07.2020
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Semiconductor package interconnect
by
Keser Lizabeth Ann
,
Alvarado Reynante Tamunan
Year of Publication
31.10.2017
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SEMICONDUCTOR PACKAGE INTERCONNECT
by
KESER, Lizabeth Ann
,
ALVARADO
,
Reynante Tamunan
Year of Publication
23.03.2017
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SEMICONDUCTOR PACKAGE INTERCONNECT
by
KESER Lizabeth Ann
,
ALVARADO Reynante Tamunan
Year of Publication
16.03.2017
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System, apparatus, and method for embedding a 3D component with an interconnect structure
by
Keser, Lizabeth Ann
,
Rae, David Fraser
,
Alvarado
,
Reynante Tamunan
Year of Publication
25.12.2018
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Semiconductor device comprising mold for top side and sidewall protection
by
Keser, Lizabeth Ann
,
Xu, Jianwen
,
Alvarado
,
Reynante Tamunan
Year of Publication
27.11.2018
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System, apparatus, and method for embedding a device in a faceup workpiece
by
Keser, Lizabeth Ann
,
Rae, David Fraser
,
Alvarado
,
Reynante Tamunan
Year of Publication
29.05.2018
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SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
by
KESER, Lizabeth Ann
,
RAE, David Fraser
,
ALVARADO
,
Reynante Tamunan
Year of Publication
28.03.2018
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PACOTE QUE COMPREENDE LIGAÇÕES DE FIO COMO DISTRIBUIDOR DE CALOR
by
YONGHAO AN
,
REYNANTE TAMUNAN ALVARADO
,
WEN YIN
Year of Publication
07.02.2023
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SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
by
KESER, Lizabeth Ann
,
RAE, David Fraser
,
ALVARADO
,
Reynante Tamunan
Year of Publication
28.12.2017
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Semiconductor device comprising mold for top side and sidewall protection
by
ALVARADO REYNANTE TAMUNAN
,
J.XU
,
KESER LIZABETH ANN
Year of Publication
06.01.2016
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Planar fan-out wafer level packaging
by
Keser Lizabeth Ann
,
Rae David Fraser
,
Alvarado Reynante Tamunan
Year of Publication
31.10.2017
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PLANAR FAN-OUT WAFER LEVEL PACKAGING
by
KESER Lizabeth Ann
,
ALVARADO Reynante Tamunan
,
RAE David Fraser
Year of Publication
21.09.2017
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INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER
by
KESER, Lizabeth Ann
,
BEZUK, Steve Joseph
,
ALVARADO
,
Reynante Tamunan
Year of Publication
15.03.2017
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