Board-Level Reliability Performance of Discrete Power Packages
Yumin Liu, Almagro, Erwin Ian, Yong Liu, Jeon, O. S., Teysseyre, Jerome
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
CALO PAUL ARMAND A, MALDO TIBURCIO A, SON, JOON SEO, ALMAGRO ERWIN IAN V, RIOS MARGIE T
Year of Publication 22.04.2010
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Year of Publication 22.04.2010
Patent
Molded packaging for wide band gap semiconductor devices
Manatad, Romel N, Almagro, Erwin Ian Vamenta, Dosdos, Bigildis, Quinones, Maria Clemens Ypil, Teysseyre, Jerome
Year of Publication 10.09.2024
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Year of Publication 10.09.2024
Patent
Vertical and horizontal circuit assemblies
Almagro, Erwin Ian, Dosdos, Bigildis, Estacio, Maria Cristina, Teysseyre, Jerome, Manatad, Romel, Wu, Chung-Lin
Year of Publication 22.08.2023
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Year of Publication 22.08.2023
Patent
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
TEYSSEYRE, Jerome, DOSDOS, Bigildis, MANATAD, Romel N, QUINONES, Maria Clemens Ypil, ALMAGRO, Erwin Ian Vamenta
Year of Publication 28.07.2022
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Year of Publication 28.07.2022
Patent
Vertical and horizontal circuit assemblies
Almagro, Erwin Ian, Dosdos, Bigildis, Estacio, Maria Cristina, Teysseyre, Jerome, Manatad, Romel, Wu, Chung-Lin
Year of Publication 16.11.2021
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Year of Publication 16.11.2021
Patent
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
TEYSSEYRE, Jerome, DOSDOS, Bigildis, ESTACIO, Maria Cristina, WU, Chung-Lin, ALMAGRO, Erwin Ian, MANATAD, Romel
Year of Publication 24.02.2022
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Year of Publication 24.02.2022
Patent
Vertical and horizontal circuit assemblies
Almagro, Erwin Ian, Dosdos, Bigildis, Estacio, Maria Cristina, Teysseyre, Jerome, Manatad, Romel, Wu, Chung-Lin
Year of Publication 09.04.2019
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Year of Publication 09.04.2019
Patent
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
TEYSSEYRE, Jerome, DOSDOS, Bigildis, ESTACIO, Maria Cristina, WU, Chung-Lin, ALMAGRO, Erwin Ian, MANATAD, Romel
Year of Publication 13.06.2019
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Year of Publication 13.06.2019
Patent
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
QUINONES MARIA CLEMENS YPIL, DOSDOS, BIRGIRDIS, TEYSSEYRE JEROME, MANATAD ROHAN N, ALMAGRO, ERWIN, IAN, VALMENTA
Year of Publication 29.07.2022
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Year of Publication 29.07.2022
Patent
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
DOSDOS Bigildis, Estacio Maria Cristina, WU Chung-Lin, ALMAGRO Erwin Ian, TEYSSEYRE Jerome, MANATAD Romel
Year of Publication 08.03.2018
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Year of Publication 08.03.2018
Patent
Stack Bonding Technique Using Heavy Aluminum Ribbon Wires
Almagro, E.I.V., Granada, H.T.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Circuit device
ERWIN IAN ALMAGRO, JEROME TEYSSEYRE, CHUNG-LIN WU, ROMEL MANATAD, MARIA CRISTINA ESTACIO, BIGILDIS DOSDOS
Year of Publication 29.06.2018
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Year of Publication 29.06.2018
Patent