MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY
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Year of Publication 19.09.2016
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Year of Publication 19.09.2016
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FLEXIBLY-WRAPPED INTEGRATED CIRCUIT DIE
ALBERS SVEN, BARTH HANS JOACHIM, SKINNER MICHAEL, BAUMGARTNER PETER, GOSSNER HARALD
Year of Publication 28.06.2016
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Year of Publication 28.06.2016
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CONTACT PADS FOR INTEGRATED CIRCUIT PACKAGES
SAHASRABUDHE SHUBHADA H, SANE SANDEEP B, SEIDEMANN GEORG, ALBERS SVEN, STOECKL STEPHAN, KOLLER SONJA
Year of Publication 25.11.2015
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Year of Publication 25.11.2015
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WEARABLE COMPUTING DEVICE
WOLTER ANDREAS, SEIDEMANN GEORG, ELSHOF BASTIAAN, ALBERS SVEN, REINGRUBER KLAUS, BARTH HANS JOACHIM, OSSIANDER TEODORA, KOLLER SONJA, PROSCHWITZ JAN
Year of Publication 29.07.2016
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Year of Publication 29.07.2016
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CHIP ARRANGEMENTS
AUGUSTIN ANDREAS, MEYER THORSTEN, ALBERS SVEN, MUELLER CHRISTIAN, BARTH HANS JOACHIM, MAHNKOPF REINHARD
Year of Publication 24.09.2014
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Year of Publication 24.09.2014
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SEMICONDUCTOR DEVICES
AUGUSTIN ANDREAS, MEYER THORSTEN, ALBERS SVEN, MUELLER CHRISTIAN, BARTH HANS JOACHIM, MAHNKOPF REINHARD
Year of Publication 16.09.2014
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Year of Publication 16.09.2014
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PACKAGE STACKING USING CHIP TO WAFER BONDING
REINGRUBER, Klaus, GEISSLER, Christian, PATTEN, Richard, DITTES, Marc, SEIDEMANN, Georg, WOLTER, Andreas, ALBERS, Sven
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
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Wafer level package structure with internal conductive layer
Albers, Sven, Patten, Richard, Geissler, Christian, Seidemann, Georg, Reingruber, Klaus
Year of Publication 23.08.2022
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Year of Publication 23.08.2022
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Package stacking using chip to wafer bonding
Albers, Sven, Dittes, Marc, Patten, Richard, Geissler, Christian, Wolter, Andreas, Seidemann, Georg, Reingruber, Klaus
Year of Publication 09.04.2024
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Year of Publication 09.04.2024
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