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"AKIMOTO GENSUKE"
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"AKIMOTO GENSUKE"
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RESIN HAVING ACID GROUP AND POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMADA SHUNSUKE
Year of Publication
08.04.2024
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CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATION MATERIAL, AND RESIST MEMBER
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMADA SHUNSUKE
Year of Publication
08.04.2024
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CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ARTICLE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMADA SHUNSUKE
Year of Publication
08.04.2024
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RESIN HAVING POLYMERIZABLE UNSATURATED GROUP, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ARTICLE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMADA SHUNSUKE
Year of Publication
08.04.2024
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EPOXY RESIN, CURABLE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
24.01.2024
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POLYHYDRIC HYDROXY RESIN
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
30.05.2023
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EPOXY RESIN
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
30.05.2023
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EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD THEREOF, CURABLE COMPOSITION, CURED MATERIAL, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, AS WELL AS, BUILD-UP FILM
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
30.05.2023
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SEMICONDUCTOR SEALING RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL AND SEMICONDUCTOR DEVICE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
30.05.2023
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SEMICONDUCTOR SEALING RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL AND SEMICONDUCTOR DEVICE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
30.05.2023
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EPOXY RESIN
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
25.05.2023
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에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
03.05.2023
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RESIN COMPOSITION, CURED MATERIAL, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
25.11.2022
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EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
14.10.2022
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EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
14.10.2022
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ACTIVE ESTER, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
by
AOYAMA KAZUMASA
,
AKIMOTO GENSUKE
,
YAMOTO KAZUHISA
Year of Publication
14.10.2022
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EPOXY RESIN, CURABLE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
by
AKIMOTO Gensuke
,
YAMOTO Kazuhisa
,
AOYAMA Kazumasa
Year of Publication
09.06.2022
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EPOXY RESIN, CURABLE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD AND BUILDUP FILM
by
AKIMOTO Gensuke
,
YAMOTO Kazuhisa
,
AOYAMA Kazumasa
Year of Publication
09.06.2022
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RESIN COMPOSITION, CURED ARTICLE, SEMICONDUCTOR ENCAPSULATION MATERIAL, AND SEMICONDUCTOR DEVICE
by
AKIMOTO Gensuke
,
YAMOTO Kazuhisa
,
AOYAMA Kazumasa
Year of Publication
19.05.2022
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EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF AND SEMICONDUCTOR SEALING MATERIAL
by
TAKAHASHI YOSHIYUKI
,
AKIMOTO GENSUKE
Year of Publication
06.09.2018
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