MULTILAYER WIRING BOARD
KATAOKA RYOHEI, OTSUKA KANJI, AKIYAMA YUTAKA, KONDO KOJI, AKIMICHI JUN, HASHIMOTO KAORU
Year of Publication 11.04.2016
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Year of Publication 11.04.2016
Patent
300MM wiring enabling 28Gbps transmission on LCP board (PALAP)
Kataoka, Ryohei, Kondo, Koji, Akimichi, Jun, Akiyama, Yutaka, Hashimoto, Kaoru, Otsuka, Kanji
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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