Morphology and reliability aspects of 40 nm eSTM™ architecture
Melul, Franck, Marca, Vincenzo Della, Bocquet, Marc, Akbal, Madjid, Laine, Pierre, Trenteseaux, Frederique, Mantelli, Marc, Hesse, Marjorie, Regnier, Arnaud, Niel, Stephan, La Rosa, Francesco
Published in Microelectronics and reliability (01.11.2021)
Published in Microelectronics and reliability (01.11.2021)
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Journal Article
A novel test structure with two active areas for eNVM reliability studies
Alkema, Khaled, Melul, Franck, Marca, Vincenzo Della, Bocquet, Marc, Akbal, Madjid, Regnier, Arnaud, Niel, Stephan, La-Rosa, Francesco
Published in 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) (15.04.2024)
Published in 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) (15.04.2024)
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Conference Proceeding
Hot Electron Source Side Injection Comprehension in 40nm eSTM
Melul, Franck, Kempf, Thibault, della Marca, Vincenzo, Bocquet, Marc, Akbal, Madjid, Trenteseaux, Frederique, Mantelli, Marc, Regnier, Arnaud, Niel, Stephan, la Rosa, Francesco
Published in 2021 IEEE International Memory Workshop (IMW) (01.05.2021)
Published in 2021 IEEE International Memory Workshop (IMW) (01.05.2021)
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Conference Proceeding