Development of Thin-Film Liquid-Crystal-Polymer Surface-Mount Packages for Ka -Band Applications
Aihara, K., Chen, M.J., Anh-Vu Pham
Published in IEEE transactions on microwave theory and techniques (01.09.2008)
Published in IEEE transactions on microwave theory and techniques (01.09.2008)
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Journal Article
Reliability of liquid crystal polymer air cavity packaging
Aihara, K., Chen, M. J., Cheng Chen, Pham, A-V H.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
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Journal Article
Development of multilayer liquid crystal polymer Ka-band downconverter modules
Aihara, Kunia, Zhang, Zhaonian, Pham, Anh-Vu, Zeeb, David, Flack, Tom, Stoneham, Ed
Published in Microwave and optical technology letters (01.02.2009)
Published in Microwave and optical technology letters (01.02.2009)
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Journal Article
Development of Thin-Film Liquid Crystal Polymer Surface Mount Packages for Ka-band Applications
Aihara, K., Anh-Vu Pham
Published in 2006 IEEE MTT-S International Microwave Symposium Digest (01.06.2006)
Published in 2006 IEEE MTT-S International Microwave Symposium Digest (01.06.2006)
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Conference Proceeding
A light weight 8-element broadband phased array receiver on Liquid Crystal Polymer
Chieh, Jia-Chi Samuel, Anh-Vu Pham, Dalrymple, Thomas W, Kuhl, David G, Garber, Brian B, Aihara, Kunia
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
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Conference Proceeding
Minimizing differential crosstalk of vias for high-speed data transmission
Aihara, Kunia, Buan, Jeremy, Nagao, Adam, Takada, Toshiyuki, Ching-Chao Huang
Published in 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2014)
Published in 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2014)
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Conference Proceeding
Intermediate connection electrical connector
TAKADA TOSHIYUKI, NAGATA MASAKAZU, AIHARA KUNIA, HUANG JEREMY, TAMAI NOBUHIRO
Year of Publication 09.02.2016
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Year of Publication 09.02.2016
Patent
INTERMEDIATE CONNECTION ELECTRICAL CONNECTOR
TAKADA TOSHIYUKI, NAGATA MASAKAZU, AIHARA KUNIA, HUANG JEREMY, TAMAI NOBUHIRO
Year of Publication 02.10.2014
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Year of Publication 02.10.2014
Patent
LCP for wafer-level chip-scale MEMS
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Fabrication techniques for processing LCP
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Introduction to electronic package engineering
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
LCP reliability
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
LCP for surface mount interconnects, packages, and modules
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Characteristics of liquid crystal polymer (LCP)
Chen, Morgan J., Aihara, Kunia, Chen, Cheng, Pham, Anh-Vu H.
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Intermediate connection electrical connector
TAKADA TOSHIYUKI, NAGATA MASAKAZU, AIHARA KUNIA, HUANG JEREMY, TAMAI NOBUHIRO
Year of Publication 01.10.2014
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Year of Publication 01.10.2014
Patent