Improved PIDNN for Server Fan Speed Control
Song, Zheng, Tian, Wenbin, Gong, Haifeng, Ahuja, Nishi
Published in 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (25.03.2024)
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Published in 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (25.03.2024)
Conference Proceeding
An advanced rack server system design For Rotational Vibration (RV) performance
Xianguang Tan, Guofeng Chen, Jiajun Zhang, Chao Liu, Nishi Ahuja, Jun Zhang
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
A Heat Transfer Study of Indirect Two-phase Cold Plate Liquid Cooling Design for Data Center
Tsai, Yuehlin, Wang, Guilin, Chen, Guofeng, Li, Sheng, Jin, Yuehong, Fang, Wenyi, Zhang, Jun, Yi, Ming, Zhou, Hongxing, Ahuja, Nishi
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Service Level Objective Adaptive Energy Efficiency Management
Song, Chuan, Jiang, Feng, Liang, Xiaoguo, Ahuja, Nishi, Kumar, Mohan J.
Published in 2022 IEEE 28th International Conference on Parallel and Distributed Systems (ICPADS) (01.01.2023)
Published in 2022 IEEE 28th International Conference on Parallel and Distributed Systems (ICPADS) (01.01.2023)
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Conference Proceeding
Power variation trend prediction in modern datacenter
Ahuja, Nishi, Song, Chuan, Sun, Yanbing, Sun, Xiaogang, Abishai, Daniel, Khanna, Rahul, Zhou, Tianyu, Zhou, Xiang, Zhang, Lifei
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
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Conference Proceeding
An Advanced Data Center Multi-Chiller Dynamic Load Distribution Methodology and Engineering Practice
Luo, Yiming, Zhou, Xiang, Cao, Jianchao, Li, Biao, Zhao, Yahui, Jing, Tangbo, Zhang, Lifei, Ahuja, Nishi, Zhang, Jun, Xia, Yuyang
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
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Conference Proceeding
A Novel Coupled Inductor to Improve Performance of Voltage Regulators in Computing System
Liang, Xiaoguo, Wang, Meng, Tamdem, Horthense, Ahuja, Nishi
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
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Conference Proceeding
Optimizing component reliability in datacenters using predictive models
Daniel, Abishai, Ahuja, Nishi
Published in 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2015)
Published in 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2015)
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Conference Proceeding
Data Center Power Density Rack Evolution with 54V for Sustainable Computing
Li, Sheng, Chen, Guofeng, Wang, Guilin, Tsai, Yuehlin, Zhang, Jun, Xu, Jialiang, Zhou, Hongxing, Gao, Ming, Ahuja, Nishi, Qiao, Qing
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Experimental Investigation on Single-phase Immersion Cooling Solution for Data Center Application
Zheng, Jianwu, Chen, Xiangwu, Cheng, Bing, He, Yongzhan, Tian, Wenbin, Zhong, Yipeng, Yu, Jiang, Zhang, Zhichao, He, Ying, Li, Yin, Zhang, Zhijie, Wu, Lihui, Ahuja, Nishi
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Impact of data center cooling strategies on component reliability
Daniel, Abishai, Ahuja, Nishi
Published in 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2014)
Published in 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2014)
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Conference Proceeding
Design Considerations for Turbo Rack with Smart Battery Backup System(BBS)
Liang, Xiaoguo, Song, Edmund, Jiang, Feng, Ahuja, Nishi, Kumar, Mohan
Published in 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2019)
Published in 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2019)
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Conference Proceeding
Investigation on Immersion Cooling Solution for Hyper-scale Data Center Application
Wang, Yulong, Gui, Chenglong, Cheng, Pengfei, Shen, Chen, Wang, Ruidong, Lv, Zhichao, Lin, Bin, Tian, Wenbin, Li, Zhiming, Zhang, Xu, Zhang, Ken, Wu, Lihui, Ahuja, Nishi
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Advanced Cold Plate Liquid Cooling Solution for Hyper-scale Data Center Application
Gui, Chenglong, Wang, Yulong, Shen, Chen, Wang, Shifeng, Wang, Ruidong, Lv, Zhichao, Lin, Bin, Tian, Wenbin, Li, Zhiming, Zhang, Xu, Zhang, Ken, Wu, Lihui, Ahuja, Nishi
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Investigation on Advanced Cold Plate Liquid Cooling Solution for Large Scale Application in Data Center
Tan, Xianguang, Liu, Hongmei, Zhang, Jiajun, Tian, Wenbin, Yu, Jiang, Ruan, Xingping, Wang, Baolin, Wu, Lihui, Zhang, Jun, Ahuja, Nishi
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
A Novel Scalable Modular Immersion Cooling System Architecture for Sustainable Data Center
Chen, Carrie, Wu, Jiahong, Zhang, Jun, Lo, Ying-Shan, Liang, Allen, Hung, Checa, Ahuja, Nishi, Qiao, Qing
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
High Power Density Rack Design Optimal for Hyper Scale Data Center Carbon Emission Reduction
Wu, Zhenghui, He, Yongzhan, Zheng, Jianwu, Cheng, Bing, Zhang, Jun, Wu, Min, Lv, Wenqing, He, Ying, Yue, Pengfei, Ahuja, Nishi, Qiao, Qing
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
A Novel Cost Efficient Cold Plate Liquid Cooling Solution for Data Center Deployment
Wu, Zhenghui, He, Yongzhan, Zheng, Jianwu, Cheng, Bing, Zhang, Jun, Lv, Wenqing, Wu, Min, He, Ying, Yue, Pengfei, Ahuja, Nishi, Qiao, Qing
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Analysis on Long Term Reliability of Single-phase Immersion Solution based on Data Center Deployment
Wang, Yulong, Gui, Chenglong, Shen, Chen, Cheng, Pengfei, Wang, Chen, Wang, Ruidong, Wang, Shifeng, Jing, Tangbo, Lin, Bin, Tian, Wenbin, Xu, Jialiang, Li, Zhiming, Zhang, Zhichao, Zhang, Xu, Zhang, Zhijie, Wu, Lihui, Wang, Kai, Ahuja, Sandeep, Ahuja, Nishi
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding