SOLDER INTERCONNECTIONS AND METHODS FOR MAKING SAME
WIRSING, ADOLF E, RAY, SUDIPTA K, KOOPMAN, NICHOLAS G, SRIVASTAVA, KAMALESH K, RYAN, JAMES G, TOTTA, PAUL A, SCHAEFER, JOSEPH G, AGARWALA, BIRENDRA N, BROSS, ARTHUR, AHSAN, AZIZ M, LEE, LIUNG, CHADURJIAN, MARK F, WALTON, ERICK G, PUTTLITZ, KARL J
Year of Publication 16.01.1996
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Year of Publication 16.01.1996
Patent
Method of forming dual height solder interconnections
PUTTLITZ; KARL J, BROSS; ARTHUR, WALTON; ERICK G, WIRSING; ADOLF E, RYAN; JAMES G, KOOPMAN; NICHOLAS G, CHADURJIAN; MARK F, SRIVASTAVA; KAMALESH K, TOTTA; PAUL A, RAY; SUDIPTA K, LEE; LIUNG, SCHAEFER; JOSEPH G, AGARWALA; BIRENDRA N, AHSAN; AZIZ M
Year of Publication 12.10.1993
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Year of Publication 12.10.1993
Patent
SOLDER MASS HAVING CONDUCTIVE ENCAPSULATING ARRANGEMENT
PUTTLITZ; KARL J, BROSS; ARTHUR, WALTON; ERICK G, WIRSING; ADOLF E, RYAN; JAMES G, KOOPMAN; NICHOLAS G, CHADURJIAN; MARK F, SRIVASTAVA; KAMALESH K, TOTTA; PAUL A, RAY; SUDIPTA K, LEE; LIUNG, SCHAEFER; JOSEPH G, AGARWALA; BIRENDRA N, AHSAN; AZIZ M
Year of Publication 14.07.1992
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Year of Publication 14.07.1992
Patent
SOLDER INTERCONNECTIONS AND METHODS FOR MAKING SAME
WIRSING, ADOLF E, RAY, SUDIPTA K, KOOPMAN, NICHOLAS G, SRIVASTAVA, KAMALESH K, RYAN, JAMES G, TOTTA, PAUL A, SCHAEFER, JOSEPH G, AGARWALA, BIRENDRA N, BROSS, ARTHUR, AHSAN, AZIZ M, LEE, LIUNG, CHADURJIAN, MARK F, WALTON, ERICK G, PUTTLITZ, KARL J
Year of Publication 20.12.1991
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Year of Publication 20.12.1991
Patent