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"AHN SEUNGYUN"
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"AHN SEUNGYUN"
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Integrated circuit packaging system with exposed conductor and method of manufacture thereof
by
Yang, DeokKyung
,
Ahn
,
SeungYun
Year of Publication
29.11.2011
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Integrated circuit packaging system with exposed conductor and method of manufacture thereof
by
YANG DEOKKYUNG
,
AHN SEUNGYUN
Year of Publication
29.11.2011
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED CONDUCTOR AND METHOD OF MANUFACTURE THEREOF
by
YANG DEOKKYUNG
,
AHN SEUNGYUN
Year of Publication
01.09.2011
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Integrated circuit packaging system with fan-in package and method of manufacture thereof
by
LEE SANGJIN
,
AHN SEUNGYUN
,
BAE JOHYUN
Year of Publication
28.07.2015
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Integrated circuit packaging system with encapsulation and method of manufacture thereof
by
AHN SEUNGYUN
,
MUN SEONGHUN
,
BAE JOHYUN
Year of Publication
04.02.2014
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Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof
by
KO CHAN HOON
,
AHN SEUNGYUN
Year of Publication
17.09.2013
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Integrated circuit package system with dual side connection and method for manufacturing thereof
by
SONG SUNGMIN
,
AHN SEUNGYUN
,
BAE JOHYUN
Year of Publication
06.08.2013
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INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH UNDERFILLING STRUCTURES AND METHOD OF MANUFACTURE THEREOF
by
KO CHAN HOON
,
AHN SEUNGYUN
Year of Publication
13.09.2012
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Package-on-package system with via z-interconnections and method for manufacturing thereof
by
Lee, Taewoo
,
Lee, Sang-Ho
,
Ahn
,
SeungYun
Year of Publication
04.09.2012
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Integrated circuit package system with multi-chip module
by
HA JONG-WOO
,
SONG SUNGMIN
,
AHN SEUNGYUN
,
BAE JOHYUN
Year of Publication
03.05.2016
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
by
AHN SEUNGYUN
,
MUN SEONGHUN
,
BAE JOHYUN
Year of Publication
29.09.2011
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Integrated circuit package system employing multi-package module techniques
by
KO WONJUN
,
AHN SEUNGYUN
,
MOON DONGSOO
Year of Publication
17.12.2013
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND METHOD FOR MANUFACTURING THEREOF
by
SONG SUNGMIN
,
AHN SEUNGYUN
,
BAE JOHYUN
Year of Publication
19.05.2011
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF
by
LEE SANGJIN
,
AHN SEUNGYUN
,
BAE JOHYUN
Year of Publication
17.03.2011
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Integrated circuit package system with dual side connection
by
Song, Sungmin
,
Ahn
,
SeungYun
,
Bae, JoHyun
Year of Publication
08.02.2011
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Integrated circuit package system with dual side connection
by
SONG SUNGMIN
,
AHN SEUNGYUN
,
BAE JOHYUN
Year of Publication
08.02.2011
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Package-on-package system with via Z-interconnections
by
Lee, Taewoo
,
Lee, Sang-Ho
,
Ahn
,
SeungYun
Year of Publication
04.01.2011
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Package-on-package system with via z-interconnections and method for manufacturing thereof
by
AHN SEUNGYUN
,
LEE TAEWOO
,
LEE SANG-HO
Year of Publication
04.09.2012
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Multichip package system
by
Lee, SeongMin
,
Ahn
,
SeungYun
,
Lee, Koo Hong
Year of Publication
21.04.2009
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Multichip package system
by
LEE SEONGMIN
,
AHN SEUNGYUN
,
LEE KOO HONG
Year of Publication
21.04.2009
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