Study of the cross contamination effect on post CMP in situ cleaning process
Kim, Hong Jin, Bohra, Girish, Yang, Hyucksoo, Ahn, Si-Gyung, Qin, Liqiao, Koli, Dinesh
Published in Microelectronic engineering (25.03.2015)
Published in Microelectronic engineering (25.03.2015)
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Journal Article
(Invited) Study on Cu Surface Flake Generation Mechanism of 1x Nm Cu CMP Process
Yang, JI Chul, Baral, Sudhir, Ahn, Si-Gyung, Yocum, Gerett
Published in Meeting abstracts (Electrochemical Society) (01.04.2016)
Published in Meeting abstracts (Electrochemical Society) (01.04.2016)
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Journal Article
Method of manufacturing semiconductor device
KIM HONG JIN, YANG JUN YOUL, KIM BO YUN, HONG MYUNG KI, KO YONG SUN, AHN SI GYUNG, HAN SOL, LEE KUN TACK, BAE SANG WON, KWON BYOUNG HO
Year of Publication 11.09.2013
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Year of Publication 11.09.2013
Patent
Method of fabricating a semiconductor device
HAN, SOL, AHN, SI-GYUNG, YANG, JUN-YOUL, LEE, KUN-TACK, KIM, HONG-JIN, HONG, MYUNG-KI, KWON, BYOUNG-HO, BAE, SANG-WON, KIM, BO-YUN, KO, YONG-SUN
Year of Publication 01.08.2013
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Year of Publication 01.08.2013
Patent
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
HAN, SOL, LEE, KUN TACK, KWON, BYOUNG HO, BAE, SANG WON, YANG, JUN YOUL, KIM, BO YUN, AHN, SI GYUNG, KIM, HONG JIN, HONG, MYUNG KI, KO, YONG SUN
Year of Publication 26.07.2013
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Year of Publication 26.07.2013
Patent