Showing
1 - 20
results of
64
for search '
"AHN, EUNUL"
'
Skip to content
Portal K.UTB
Čeština
Login
TBU Catalog
e-resources
E-THESES
All Fields
Title
Author
Subject
Find
Advanced Search
Search Results - "AHN, EUNUL"
Showing
1 - 20
results of
64
for search '
"AHN, EUNUL"
'
, query time: 1.29s
Refine Results
Sort
Relevance
Date Descending
Date Ascending
1
Loading…
Method for manufacturing printed circuit boardPCB and ball grid arrayBGA package
by
AHN
,
EUNUL
,
HA, WOONG-KY
,
LEE, YOUNG-MIN
Year of Publication
15.02.2000
Get full text
Patent
Save to List
Saved in:
2
Loading…
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
26.05.2016
Get full text
Patent
Save to List
Saved in:
3
Loading…
PRINTED CIRCUIT BOARDS HAVING METAL LAYERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
by
LEE YONG-KWAN
,
KIM HEE-JEONG
,
AHN EUNUL
Year of Publication
16.04.2015
Get full text
Patent
Save to List
Saved in:
4
Loading…
Semiconductor package with reduced internal stress
by
PARK JIN-WOO
,
AHN EUNUL
Year of Publication
23.09.2010
Get full text
Patent
Save to List
Saved in:
5
Loading…
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
21.08.2014
Get full text
Patent
Save to List
Saved in:
6
Loading…
Semiconductor package and method of forming the same
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
27.05.2014
Get full text
Patent
Save to List
Saved in:
7
Loading…
WAFER POLISHING METHOD
by
CHOI JUNG-HO
,
CHO MOON-GI
,
AHN EUNUL
Year of Publication
17.12.2015
Get full text
Patent
Save to List
Saved in:
8
Loading…
METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS
by
AHN EUNUL
,
LEE TEAK-HOON
Year of Publication
20.11.2008
Get full text
Patent
Save to List
Saved in:
9
Loading…
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
08.08.2013
Get full text
Patent
Save to List
Saved in:
10
Loading…
Semiconductor package and method of forming the same
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
16.04.2013
Get full text
Patent
Save to List
Saved in:
11
Loading…
Stacked semiconductor package having reduced height
by
KIM YOUNG-LYONG
,
LEE BYUNG-WOO
,
AHN EUNUL
Year of Publication
15.01.2013
Get full text
Patent
Save to List
Saved in:
12
Loading…
Integrated circuit chip and method of manufacturing the same and flip chip package having the integrated chip and method of manufacturing the same
by
LEE JONG-HO
,
PARK JIN-WOO
,
KANG SUN-WON
,
AHN EUNUL
,
SHIN DONG-KIL
Year of Publication
04.02.2015
Get full text
Patent
Save to List
Saved in:
13
Loading…
Integrated circuit chip and flip chip package having the integrated circuit chip
by
LEE JONG-HO
,
PARK JIN-WOO
,
KANG SUN-WON
,
AHN EUNUL
,
SHIN DONG-KIL
Year of Publication
30.12.2014
Get full text
Patent
Save to List
Saved in:
14
Loading…
SEMICONDUCTOR DEVICE HAVING FUSE PATTERN
by
SHIN JOO-WEON
,
KIM SANG-YOUNG
,
CHO MOON-GI
,
LEE MIN-HO
,
AHN EUNUL
Year of Publication
12.11.2015
Get full text
Patent
Save to List
Saved in:
15
Loading…
Semiconductor device having fuse pattern
by
SHIN JOO-WEON
,
KIM SANG-YOUNG
,
CHO MOON-GI
,
LEE MIN-HO
,
AHN EUNUL
Year of Publication
01.09.2015
Get full text
Patent
Save to List
Saved in:
16
Loading…
Semiconductor package and method of forming the same
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
06.03.2012
Get full text
Patent
Save to List
Saved in:
17
Loading…
Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
by
SHIN CHANG-WOO
,
CHUNG HYUN-SOO
,
KIM JUM-GON
,
CHUN JIN-HO
,
AHN EUNUL
Year of Publication
27.05.2014
Get full text
Patent
Save to List
Saved in:
18
Loading…
Semiconductor package and method of forming the same
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
01.12.2011
Get full text
Patent
Save to List
Saved in:
19
Loading…
Semiconductor package and method of forming the same
by
CHUNG TAE-GYEONG
,
HWANG TAE-JOO
,
AHN EUNUL
Year of Publication
20.09.2011
Get full text
Patent
Save to List
Saved in:
20
Loading…
INTER CONNECTION STRUCTURE INCLUDING COPPER PAD AND PAD BARRIER LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME
by
SHIN CHANG-WOO
,
CHUNG HYUN-SOO
,
KIM JUM-GON
,
CHUN JIN-HO
,
AHN EUNUL
Year of Publication
19.09.2013
Get full text
Patent
Save to List
Saved in:
1
2
3
4
Next
[4]
RSS Feed
Email Search
Save Search
Search History
Back
Refine Results
Page will reload when a filter is selected or excluded.
Limit to articles from scholarly journals
Limit to articles with full text available
Limit to Open Access content
Exclude newspaper articles
Include articles at other libraries
Expand results using synonyms
Format
Patent
64 results
64
Subject Area
chemistry
64 results
64
medicine
64 results
64
sciences
64 results
64
physics
1 results
1
Topic
electricity
64 results
64
basic electric elements
63 results
63
electric solid state devices not otherwise provided for
63 results
63
semiconductor devices
63 results
63
casings or constructional details of electric apparatus
4 results
4
electric techniques not otherwise provided for
4 results
4
See more
Language
English
64 results
64
Chinese
6 results
6
Korean
1 results
1
Year of Publication
From:
To:
Database
esp@cenet
64 results
64