A 3D Stackable 1T1C DRAM: Architecture, Process Integration and Circuit Simulation
Huang, Meng, Si, Shufang, He, Zheng, Zhou, Ying, Li, Sijia, Wang, Hong, Liu, Jinying, Xie, Dongsheng, Yang, Mengmeng, You, Kang, Choi, Chris, Tang, Yi, Li, Xiaojie, Qian, Shibing, Yang, Xiaodong, Hou, Long, Bai, Weiping, Liu, Zhongming, Tang, Yanzhe, Wu, Qiong, Wang, Yanqin, Dou, Tao, Kim, Jake, Wang, Gui-Lei, Baisp, Jie, Takao, Adachi, Zhao, Chao, Yoo, Abraham
Published in 2023 IEEE International Memory Workshop (IMW) (01.05.2023)
Published in 2023 IEEE International Memory Workshop (IMW) (01.05.2023)
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