Through-Silicon Via Fill for 3D Interconnect Applications
Mathew, Varughese, Chatterjee, Ritwik, Jones, Robert, Garcia, Sam, Acosta, Eddie, Huang, Zhihong
Published in ECS transactions (20.03.2009)
Published in ECS transactions (20.03.2009)
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Journal Article
Selective Formation of Micropads for 3D Interconnect Applications
Mathew, Varughese, Chatterjee, Ritwik, Garcia, Sam, Acosta, Eddie, Jones, Robert
Published in ECS transactions (28.09.2007)
Published in ECS transactions (28.09.2007)
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Journal Article
Electroless Plated CoWB and COWPB Films for Copper Cap Applications
Mathew, Varughese, Michaelson, Lynne, Garcia, Sam, Acosta, Eddie, Werho, Dennis, Gregory, Richard, Jiang, Zhi-Xiong, Kim, Kiwoon
Published in ECS transactions (07.07.2006)
Published in ECS transactions (07.07.2006)
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Journal Article
Progress of 3D Integration Technologies and 3D Interconnects
Pozder, S., Chatterjee, R., Jain, A., Zhihong Huang, Jones, R.E., Acosta, E.
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding
3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding
Pozder, Scott, Jain, Ankur, Chatterjee, Ritwik, Huang, Zhihong, Jones, Robert E., Acosta, Eddie, Marlin, Bill, Hillmann, Gerhard, Sobczak, Martin, Kreindl, Gerald, Kanagavel, Senthil, Kostner, Hannes, Pargfrieder, Stefan
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding
Selective Formation of Micropads for 3D Interconnect Applications
Mathew, Varughese, Chatterjee, Ritwik, Garcia, Sam, Acosta, Eddie, Jones, Robert
Published in Meeting abstracts (Electrochemical Society) (28.09.2007)
Published in Meeting abstracts (Electrochemical Society) (28.09.2007)
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Journal Article
Three dimensional chip stacking using a wafer-to-wafer integration
Chatterjee, Ritwik, Zussy, Marc, Roman, Antonio, Louveau, Olivier, Maitrejean, Sylvain, Louis, Didier, Kernevez, Nelly, Sillon, Nicolas, Passemard, Gerard, Pol, Victor, Mathew, Varughese, Fayolle, Murielle, Garcia, Sam, Sparks, Terry, Huang, Zhihong, Leduc, Patrick, Pozder, Scott, Jones, Bob, Acosta, Eddie, Charlet, Barbara, Enot, Thierry, Heitzmann, Michel
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding
Electromigration of Cu-Sn-Cu micropads in 3D interconnect
Zhihong Huang, Chatterjee, R., Justison, P., Hernandez, R., Pozder, S., Jain, A., Acosta, E., Gajewski, D.A., Mathew, V., Jones, R.E.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Through-Silicon Via Fill for 3D Interconnect Applications
Mathew, Varughese, Chatterjee, Ritwik, Jones, Robert, Garcia, Sam, Acosta, Eddie, Huang, Zhihong
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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Journal Article