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Year of Publication 23.10.2008
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Year of Publication 23.10.2008
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TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
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Year of Publication 22.02.2007
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Year of Publication 22.02.2007
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TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
ZHANG YUN, STEINIUS ORTRUD, RIETMANN CHRISTIAN, RICHARDSON THOMAS B, KLEINFELD MARLIES, ZAVARINE IGOR, ABYS JOSEPH A
Year of Publication 15.02.2007
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Year of Publication 15.02.2007
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Copper metallization of through silicon via
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Year of Publication 02.03.2010
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COBALT SELF-INITIATED ELECTROLESS VIA FILL FOR STACKED MEMORY CELLS
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Year of Publication 31.08.2006
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Year of Publication 31.08.2006
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Cobalt self-initiated electroless via fill for stacked memory cells
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Year of Publication 24.08.2006
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Year of Publication 24.08.2006
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Tin-silver solder bumping in electronics manufacture
STEINIUS, ORTRUD, RICHARDSON, THOMAS B, ZAVARINE, IGOR, ZHANG, YUN, ABYS, JOSEPH A, KLEINFELD, MARLIES, RIETMANN, CHRISTIAN
Year of Publication 01.09.2013
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Year of Publication 01.09.2013
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Tin-silver solder bumping in electronics manufacture
ZHANG YUN, STEINIUS ORTRUD, RIETMANN CHRISTIAN, RICHARDSON THOMAS B, KLEINFELD MARLIES, ZAVARINE IGOR, ABYS JOSEPH A
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Year of Publication 19.06.2013
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COPPER METALLIZATION OF THROUGH SILICON VIA
ZHANG YUN, LIN XUAN, WANG CHEN, PANECCASIO, JR. VINCENT, WANG CAI, HURTUBISE RICHARD, RICHARDSON THOMAS B, ABYS JOSEPH A
Year of Publication 05.02.2009
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Year of Publication 05.02.2009
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Multi-purpose finish for printed wiring boards and method of manufacture of such boards
STACY, BRUCE F, XU, CHEN, SMITH, BRIAN T, ABYS, JOSEPH A, FAN, CHONGLUN
Year of Publication 07.09.2005
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Year of Publication 07.09.2005
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Year of Publication 17.04.2013
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Year of Publication 17.04.2013
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