Taphonomic analysis of rodent bone accumulations produced by Geoffroy's cat (Leopardus geoffroyi, Carnivora, Felidae) in Central Argentina
Montalvo, Claudia I., Bisceglia, Silvina, Kin, Marta S., Sosa, Ramón A.
Published in Journal of archaeological science (01.07.2012)
Published in Journal of archaeological science (01.07.2012)
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Journal Article
Owl pellet dispersal by wind: Observations and experimentations
Montalvo, Claudia I., Cheme Arriaga, Lucas, Tallade, Pedro O., Sosa, Ramón A.
Published in Quaternary international (08.11.2012)
Published in Quaternary international (08.11.2012)
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Journal Article
Impact of Non-Coplanarities on Microstructure and Properties of Sintered NP-Cu Interconnections
Amirnasiri, Ali, Sosa, Ramon A., Tian, Mengkun, Antoniou, Antonia, Smet, Vanessa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates
Sosa, Ramon A., Surillo, Emanuel Torres, Molina-Mangual, Christian, Smet, Vanessa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Bayesian Optimization of Large Glass Package Architecture for System-Level Reliability in High-Performance Computing Applications
Surillo, Emanuel Torres, Sosa, Ramon A., Molina, Christian, Park, Hyunggyu, Nimbalkar, Pratik, Srirangan, Sriram, Dahal, Lila D., Lee, Yongwon, Smet, Vanessa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Low-temperature all-Cu interconnections formed by pressure-less sintering of Cu-pillars with nanoporous-Cu caps
Sosa, Ramon A., Mohan, Kashyap, Antoniou, Antonia, Smet, Vanessa, Thienpont, Denise, Tan, YY
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Cu Pillar with Nanocopper Caps: The Next Interconnection Node Beyond Traditional Cu Pillar
Sosa, Ramon A., Mohan, Kashyap, Nguyen, Luu, Tummala, Rao, Antoniou, Antonia, Smet, Vanessa
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding