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Reliability of the aging lead free solder joint
Hongtao Ma, Suhling, J.C., Lall, P., Bozack, M.J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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An embedded device technology based on a molded reconfigured wafer
Brunnbauer, M., Furgut, E., Beer, G., Meyer, T., Hedler, H., Belonio, J., Nomura, E., Kiuchi, K., Kobayashi, K.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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A CMOS-compatible process for fabricating electrical through-vias in silicon
Andry, P.S., Tsang, C., Sprogis, E., Patel, C., Wright, S.L., Webb, B.C., Buchwalter, L.P., Manzer, D., Horton, R., Polastre, R., Knickerbocker, J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
Wright, S.L., Polastre, R., Gan, H., Buchwalter, L.P., Horton, R., Andry, P.S., Sprogis, E., Patel, C., Tsang, C., Knickerbocker, J., Lloyd, J.R., Sharma, A., Sri-Jayantha, M.S.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing
Yeoh, A., Chang, M., Pelto, C., Tzuen-Luh Huang, Balakrishnan, S., Leatherman, G., Agraharam, S., Guotao Wang, Zhiyong Wang, Chiang, D., Stover, P., Brandenburger, P.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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A study on package stacking process for package-on-package (PoP)
Yoshida, A., Taniguchi, J., Murata, K., Kada, M., Yamamoto, Y., Takagi, Y., Notomi, T., Fujita, A.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Interface failure in lead free solder joints
Darveaux, R., Reichman, C., Islam, N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Novel wafer dicing and chip thinning technologies realizing high chip strength
Takyu, S., Kurosawa, T., Shimizu, N., Harada, S.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability
Luhua Xu, Pang, J.H.L.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Investigation of Cu/low-k film delamination in flip chip packages
Zhai, C.J., Ozkan, U., Dubey, A., Sidharth, Blish, R.C., Master, R.N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding