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Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration
Kim, TaeSeong, Cho, Sohye, Hwang, SeonKwan, Lee, Kyuha, Hong, Yikoan, Lee, Hakseung, Cho, Hyokyung, Moon, Kwangjin, Na, Hoonjoo, Hwang, Kihyun
Published in Proceedings / Electronic Components Conference (01.06.2021)
Published in Proceedings / Electronic Components Conference (01.06.2021)
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Conference Proceeding
2.5D/3D Integration Technologies for Circuit Obfuscation
Yang Xie, Chongxi Bao, Yuntao Liu, Srivastava, Ankur
Published in Proceedings / International Workshop on Microprocessor Test and Verification (01.12.2016)
Published in Proceedings / International Workshop on Microprocessor Test and Verification (01.12.2016)
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Conference Proceeding
Development of High Frequency Device Using Glass or Fused Silica with 3D Integration
Takahashi, Shintaro, Sato, Yoichiro, Horiuchi, Kohei, Ono, Motoshi
Published in Proceedings / Electronic Components Conference (01.05.2017)
Published in Proceedings / Electronic Components Conference (01.05.2017)
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Conference Proceeding
NEXX Systems to Participate in IMEC's Industrial Affiliation Program on 3D Integration
Published in Business Wire
(17.06.2008)
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Newsletter
Three-dimensional stacking of silicon chips - An industrial viewpoint
Weber, Werner
Published in 28th Symposium on Microelectronics Technology and Devices (SBMicro 2013) (01.09.2013)
Published in 28th Symposium on Microelectronics Technology and Devices (SBMicro 2013) (01.09.2013)
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Conference Proceeding
(Invited) 3D Passive Devices and Through-Substrate Connections for Medical and Automotive Applications
Bunel, Catherine, Lefeuvre, E, Jacqueline, S, Jatlaoui, M
Published in ECS transactions (03.07.2019)
Published in ECS transactions (03.07.2019)
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Journal Article
Technology and Application of 3D Interconnect
Jones, R.E.
Published in 2007 IEEE International Conference on Integrated Circuit Design and Technology (01.05.2007)
Published in 2007 IEEE International Conference on Integrated Circuit Design and Technology (01.05.2007)
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Conference Proceeding
Thermally robust clocking schemes for 3D integrated circuits
Mondal, Mosin, Ricketts, Andrew J., Kirolos, Sami, Ragheb, Tamer, Link, Greg, Vijaykrishnan, N., Massoud, Yehia
Published in Proceedings of the conference on Design, automation and test in Europe (16.04.2007)
Published in Proceedings of the conference on Design, automation and test in Europe (16.04.2007)
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Conference Proceeding
Expression of Concern: Thermally Robust Clocking Schemes for 3D Integrated Circuits
Mondal, Mosin, Ricketts, Andrew J., Kirolos, Sami, Ragheb, Tamer, Link, Greg, Vijaykrishnan, N., Massoud, Yehia
Published in 2007 Design, Automation & Test in Europe Conference & Exhibition (01.04.2007)
Published in 2007 Design, Automation & Test in Europe Conference & Exhibition (01.04.2007)
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Conference Proceeding