Search Results - "2024 47th International Spring Seminar on Electronics Technology (ISSE)" :: K.UTB vyhledávací portál

Hydrogen in Automotive: LCA Study

by Fridrich, Michael, Prazanova, Anna, Knap, Vaclav, Weinzettel, Jan
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Soil Degradation of Sustainable PLA/Flax Substrates and Printed Circuit Board Assemblies

by Farkas, Csaba, Csiszar, Andras, Gal, Laszlo, Czaun, Reka, Geczy, Attila
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Evaluating the Performance of Measurements Systems Using Data Processing Methods Based on Kalman Filter

by Florin, Flutur Alexandru, Septimiu Sever, Pop, Vlad, Bande
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Evaluation of semipermeable membranes for encapsulating gas sensors in human intestinal environments

by Stadermann, Felix, Kost, Victoria Constance, Nieweglowski, Krzysztof, Meier, Karsten, Bock, Karlheinz
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Lithium-Ion Cell and Battery Testing by Spectral Analysis

by Kishkin, Krasimir, Arnaudov, Dimitar, Todorov, Venelin
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Noise Measurement System Based on Cross-Correlation Method

by Davidas, Cristina, Pop, Ovidiu Aurel, Viman, Liviu, Stetco, Elena Mirela, Petrisor, Traian
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Design of a Flat Coil Electrothermal Vaporization Device for Inductively Coupled Plasma Optical Emission Spectrometry

by Cadar, S., Petreus, D., Patarau, T., Szilagyi, E.
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Analyzing the Impact of Surface Treatment on Solder Joint Voids

by Rous, Pavel, Steiner, Frantisek
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Electrochemical Migration Resistance of Gold Surface Finishes

by Klimtova, Marketa, Vesely, Petr, Kralova, Iva, Wong, Yew Hoong, Faizul Mohd Sabri, Mohd, Dusek, Karel
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Low Temperature Adhesive Die Bonding for Sensitive MEMS Dies

by Beena, Nithin Anujan, Lorenz, Lukas, Ludewig, Thomas, Swiecinski, Kai, Bock, Volker
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Variations in Open Circuit Voltage of Cycle-Aged Lithium-Ion Batteries due to Silicon-Enhanced Anodes

by Galasso, Michele, Schwunk, Simon, Knap, Vaclav
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Influence of Number of Turns on Common-Mode Choke's Characteristics

by Damnjanovic, Mirjana, Kisic, Milica, Milutinov, Miodrag, Bodic, Milan, Aleksic, Stanko
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Active balancing using the DC2100B-C and DC2100B-D module

by Olteanu, Mirela, Petreus, Dorin, Petri, Ana-Maria
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Investigation of Sn grain growth in solder joints by numerical simulations

by Bozsoki, Istvan, Geczy, Attila, Illes, Balazs
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Realization of Cost-Effective Supercapacitors Utilizing Substitutable Materials

by Burcea, Irina Madalina, Negroiu, Rodica Cristina, Mihailescu, Bogdan, Svasta, Paul, Moise, Madalin Vasile, Ionescu, Ciprian
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Modeling the Optical Response of a Periodic Nanoparticle Arrangement with the Finite Element Method

by Kovacs, Rebeka, Bonyar, Attila
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Occurrence of Voids in Soldered Joints for Electrical Engineering

by Chvosta, Tomas, Dusek, Karel, Gurcik, Tomas
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Effects of Thermal Cycling and PCB Substrate Type on Reliability of Solder Joints

by Fros, Denis, Klimtova, Marketa, Kralova, Iva
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Experimental Study of a Novel Printed Circuit Board Interconnection Technology

by Adavi, Karamat, Quednau, Sebastian, Muller, Xaver, Ernst, Daniel, Meier, Karsten, Platz, Hanno
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications

by Janda, Martin, Kalas, David, Sima, Karel, Reboun, Jan
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)

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