Atomic Layer Processing of MoS2
Jen, Wesley, Hues, John D., Soares, Jake, Letourneau, Steven, Lawson, Matthew, Choudhury, Devika, Mane, Anil U., Lu, Yu, Wu, Yaqiao, Hues, Steven M., Li, Lan, Elam, Jeffrey W., Graugnard, Elton
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Get full text
Conference Proceeding
R(t)-Based Spike-Timing-Dependent Plasticity in Memristive Neural Networks
Afrin, Farhana, Cantley, Kurtis D.
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Get full text
Conference Proceeding
Quantum Time-Domain Simulation in 3-D Electron Nano-devices
Antonov, Kate, Sullivan, Dennis
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Get full text
Conference Proceeding
An All-Optical 2-Bit Adder Composed of Fabry-Perot Devices
Ellaine Houle, Jennifer, Sullivan, Dennis, Zadehgol, Ata, Kuzyk, Mark G.
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Get full text
Conference Proceeding
Power management architectures for high performance NAND systems
Nubile, Luca, Iorio, Biagio, Yu, Martin, Binfet, Jeremy, Piccardi, Michele, Cardinali, Riccardo, Di Francesco, Walter, Mohammadzadeh, Ali
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Get full text
Conference Proceeding
Welcome to the IEEE WMED 2023
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED)
(01.03.2023)
Get full text
Conference Proceeding
IEEE WMED 2023 Keynote Address
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED)
(01.03.2023)
Get full text
Conference Proceeding
Metal-to-Metal Flip-Chip Bonding for High-Temperature 3D SiC IC Integration and Packaging
Li, Feng, Shi, Jiaqi
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Published in 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED) (01.03.2023)
Get full text
Conference Proceeding