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The Effect of Cu/SiO2 Rough Interface on TSV Electroplating Process for Electronic Packaging
Lv, Weishan, Lei, Xin, Liu, Jiaxin, Zhu, Fulong
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Finite element simulation of Cu-SiO2 direct hybrid bonding: impact of via on bonding integration
Zhao, Guoqiang, Wang, Wenzhi, Zhang, Huimin, Zhang, Nan, Zhou, Xiaofeng, Zhao, Yi
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Insulated, Passivated & Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating
Park, Soojae, Jeong, Hwajin, Choi, Kyujung, Min, Eulgi
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration
Dubey, Vikas, Wunsch, Dirk, Gottfried, Knut, Kinner, Robert, Suroshe, Rajat, Kuchler, Matthias, Stephan, Ronny, Schermer, Sebastian, Helke, Christian, Hasse, Micha, Reuter, Danny, Weimer, Maik, Schulz, Stefan
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of Thick Sc0.2Al0.8N Film for MEMS Application
Sharma, Jaibir, Chen, Daniel Ssu-Han, Shun Teo, Yong, Liu, Peng
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications
Wang, Chuei-Tang, Shang, Shu-An, Hsiao, Yu-Ming, Yan, Kathy, Jeng, Shin-Puu, Lee, Kam Heng, He, Jun
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of underground structure cover with slit for radio wave transmission
Yi, Yuantong, Tateishi, Eiichi, Kumagae, Takaya, Kai, Nobuhiro, Yamaguchi, Tatsuya, Kanaya, Haruichi
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Numerical and Experimental Investigation of Package Warpage of Large Mold-First FOWLP
Zhang, Xiaowu, Lim, Sharon Pei Siang, Lau, Boon Long, Han, Yong, Jong, Ming Chinq, Wang, Xiaobai, Liu, Songlin
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Integration of Artificial Neural Network and Finite Element Simulation for Package Warpage Prediction
Panigrahy, Sunil Kumar, Xing Che, Fa, Ong, Yeow Chon, Nagavenkata Nune, Prasad, Ng, Hong Wan
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Ultrathin New Dielectric Interlayer Layer - Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications
Cheemalamarri, Hemanth Kumar, Lee Hou Jang, Steven, Miao, Ji Hong, V, Nandini, S, Chandra Rao B S, King Jien, Chui, Rao, Vempati Srinivasa, Singh, Navab
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Alignment Vision System for Hybrid Bonding
Nagatomo, Daisuke, Sugiura, Takamasa, Kajinami, Masato, Ueyama, Shinji, Tokumiya, Takahiro, Oh, Seungyeol, Ahn, Sungmin, Choi, Euisun, Woo, Siwoong, Lee, Hyunjin, Lee, Byungjoon, Rhee, Minwoo Daniel
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding
Roy, Sangita Chaki, Guan, Chen Gim, Venkataraman, Nandini, Lee, Wen, Singh, Navab
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications
Tsai, Min-Yan, Kao, Chin-Li, Wang, Shan-Bo, Lin, Yung-Sheng, Chiu, Meng-Chun, Liang, Chien-Lung
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
The Effect of Filler Mass Fraction on The Physical Properties of Conductive Silver Adhesives
Yu, Ziniu, Lv, Weishan, Zhu, Fulong
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Integration of plasma dicing in the collective die to wafer hybrid bonding process
Suhard, Samuel, Kennes, Koen, Bex, Pieter, Georgieva, Violeta, Schleicher, Filip, Walsby, Edward, Barnett, Richard, Jourdain, Anne, Beyer, Gerald, Beyne, Eric
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder Interconnects
Albrecht, Oliver, Hohne, Robert D. J., Barkur, Dharshan, Meier, Karsten, Bock, Karlheinz
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Impact of Wafer Pre-thin Thickness on Stealth Dicing Performance
Lim, Dao Kun, Vempaty, Venkata Rama Satya Pradeep, Sim, Wen How, Singh, Harjashan Veer
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
RC delay mitigation for sub 700 nm hybrid bonding pitch
Lhostis, Sandrine, Ayoub, Bassel, Fremont, Helene, Moreau, Stephane, Mermoz, Sebastien, Deloffre, Emilie, Souchier, Emeline, Cacho, Maria Gabriela Gusmao, Aybeke, Ece, Lamontagne, Patrick, Rey, Christelle, Tournier, Arnaud
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding