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Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers
Gourikutty, Sajay Bhuvanendran Nair, Jong, Ming Chinq, Kanna, Chockanathan Vinoth, Ho, David Soon Wee, Wu, Jiaqi, Mandal, Rathin, Li, Nanxi, Lim, Teck Guan, Liow, Jason Tsung-Yang, Bhattacharya, Surya
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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High Reliability Solution of 2.5D Package Technologies
Lin, Hsin Jou, Lin, Vito, Lin, Joe, Lu, Ying Ju, Wang, David, Wang, Yu Po
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (01.01.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (01.01.2021)
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Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration
Lia, Jay, Tsai, Fang-Lin, Li, Jackson, Pan, George, Chan, Mu-Hsuan, Zheng, Louise, Chen, Steven, Kao, Nicholas, Lai, David, Wan, Katch, Wang, Yu-Po
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Dual Polarized FOWLP AiP for 5G Base Station Applications
Mei, Sun, Guan, Lim Teck
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Intermetallic Growth and Void Formation Mechanism in Flip Chip Copper Pillar Interconnects: Role of the Underfill Material
Wang, Miao, Uehling, Trent, Mavinkurve, Amar, Uehling, Paige, Ahmed, Sudan, Foong, Cs
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding
Ji, HongMiao, Chui, King-Jien
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Influence of Packaging Structure on Switch Performance of GaN HEMT Half-Bridge Circuits
Ma, Chuangwei, Zhu, Wenhui, Wang, Liancheng
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding
Chen, Yi, Liang, Shuibao, Liu, Canyu, Liu, Changqing, Zhou, Zhaoxia
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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High Density Redistribution Layers (< 2 μm L/S) for Chiplets Packaging
Ho, Soon Wee, Kanna, Chockanathan Vinoth, Chinq, Jong Ming, Chong, Chai Tai
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Characteristics of Plasma Treated Surface for SiO2-Si Wafer Bonding
Choi, Wonyoung, Kim, Wooyoung, Hahn, Seung Ho, Lim, Kyeongbin, Lee, Hyunjae, Rhee, Minwoo
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Bunch of Wires Interface PHY Design for Multi-Chiplet Systems
Ahmed, Maudood, Chaudhary, Muhammad Waqas, Heinig, Andy
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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EPTC 2021 Invited Technology Talk: Roadmap Based on Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Performance
Refai-Ahmed, Gamal, Ramalingam, Suresh, Cader, Tahir, Strader, Jason, Huttunen, Jari, Torza, Anthony, Rangarajan, Srikanth, Sammakia, Bahgat, Gektin, Vadim, Kabbani, Hussam
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling
Zhu, Jiaqi, Su, Yutai, Chuantong, Chen, Siow, Kim S., Tang, Ruitao, Long, Xu
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Systematic Investigation and Characterization of Ag Paste for LED Die Attach
Hu, Liangxing, Tao, Jing, Bao, Shuyu, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Tan, Sai Choo, Chew, Kai Hwa, Tan, Chuan Seng
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Growth kinetics of intermetallic compound in solder joints during thermal cycling: a review
Xu, Junmeng, Guo, Ying, Su, Yutai, Tang, Ruitao, Long, Xu
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Wafer-to-Wafer Hybrid Bonding Challenges for 3D IC Applications
Li, H. Y., Ji, Hong Miao, Kiat, Alfred Neo Siang, Kawano, Masaya
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI)
Loh, Woon Leng, Guan, Lim Teck, Chui, K.-J.
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Developments in Advanced Packaging Failure Analysis using Correlated X-Ray Microscopy and LaserFIB
Viswanathan, Vignesh, Jiao, Longan
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Investigation of The Flow Behaviors for Capillary Underfill Process in Flip-Chip Packaging
Lo, Shih Kun, Chien, Tzu Chieh, Liu, Hui Chung, Ming, Lu, Lai, Chen, Kuang Hsiung
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Copper wire degradation under high temperature and high humidity without molding compound
Lim, Michael Joo Zhong, Goroll, Michael, Loh, Hai Guan, Chen, Zhong, Tan, Chuan Seng
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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