Single Phase Passive Hydrocarbon Immersion Cooling of High-power ICs
Luiten, Wendy
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Comparison of GaN HEMTs Thermal Results through different measurements methodologies: Validation with 3D simulation
Jakani, Anass, Sommet, Raphael, Gaillard, Florent, Nallatamby, Jean-Christophe
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Suggestions for Extending the Scope of the Transient Dual Interface Method
Poppe, Andras, Vass-Varnai, Andras, Sarkany, Zoltan, Rencz, Marta, Hantos, Gusztav, Farkas, Gabor
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Comparative multiphysics simulation of VO2 based lateral devices
Al-Abassi, Salam A. W., Darwish, Mahmoud, Pohl, Laszlo, Mizsei, Janos, Neumann, Peter
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
AI-TWILIGHT: AI-digital TWIn for LIGHTing - a new European project
Martin, Genevieve, Poppe, Andras, Schops, Sebastian, Kraker, Elke, Marty, Christophe, Soer, Wouter, Yu, Joan
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Measurement and simulation of the three-dimensional temperature field in an RF SOI chip
Nguyen, Tuyen-Duc, Dunn, Isaac Haik, Nefzaoui, Elyes, Hamaoui, Georges, Basset, Philippe, Loraine, Jerome, Lahbib, Imene, Grandchamp, Brice, U'Ren, Gregory
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Thermal Analysis of SiC Power Semiconductor Packages using the Structure Function
Race, Salvatore, Kovacevic-Badstuebner, Ivana, Nagel, Michel, Ziemann, Thomas, Tiwari, Shweta, Mengotti, Elena, Bianda, Enea, Jormanainen, Joni, Grossner, Ulrike
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
In-Situ Degradation Monitoring of Sputtered Thin Al Films on Si Cantilevers Inside SEM During Accelerated Stress Testing using Nano-Indenter Actuation and Vibration Loading
Johrmann, Nathanael, Osipova, Valentina, Breitenreiner, Sebastian, Pufall, Reinhard, Wunderle, Bernhard
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Application of Vanadium Dioxide for Thermal Sensing
Darwish, Mahmoud, Al-Abassi, Salam A. W., Neumann, Peter, Mizsei, Janos, Pohl, Laszlo
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
A Comparison of the Thermohydraulic Performance of Oil-Cooled Heat Sink Geometries for Power Electronics
Heyde, Judith Vander, T'Jollyn, Ilya, Rogiers, Jana, Schoonjans, Thomas, Nonneman, Jasper, Schlimpert, Stephan, De Paepe, Michel
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
A Parametric Simulative Study for Si and SiC Semiconductor Devices Under Various Accelerated Testing Conditions Using Rate- and Temperature Dependent Inelastic Material Data
Forndran, Freerik, Heilmann, Jens, Metzler, Martin, Leicht, Markus, Wunderle, Bernhard
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Liquid cooling solutions for Automotive HPC: Experimental Thermo-Fluidic Characterisation
Grun, Tobias, May, Daniel, Straub, Hubert, Jakub, Gromala Przemyslaw, Wunderle, Bernhard
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Evaluation of Failure Mechanisms in Low Thermal Resistance Interface Materials for Reliable Electronics Applications
Wilken, Karen, Grossmann, Matthias, De Santis, Cristian
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure
Rajaguru, Pushpa, Bella, Martina, Bailey, Chris
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Thermo-fluidic characterization of automotive LiDAR module under realistic enforced air-cooling conditions in a closed wind tunnel
Tavakolibasti, Majid, Schacht, Ralph, Wunderle, Bernhard, Nowak, Torsten
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Clarification of Error Factors in Thermal Impedance Measurements Using SiC-MOSFET Body Diodes Compared to SWITCH-MOS
Kato, Fumiki, Sato, Shinji, Harda, Shinsuke, Hozoji, Hiroshi, Sakai, Aki, Wantanabe, Kinuyo, Yamaguchi, Hiroshi, Sato, Hiroshi
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Thermal effect on performance of N-MOSFET transistor under pulsed RF tests
Belaid, M.A., Almusallam, A.
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding