Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB
Stoukatch, Serguei, Andre, Nicolas, Dupont, Francois, Redoute, Jean-Michel, Flandre, Denis
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Reactive chip level bonding based on CuO/Al reactive multilayer systems
Vogel, Klaus, Schachler, Ralph, Roscher, Frank, Wiemer, Maik, Kuhn, Harald
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Accelerated Ageing Test and Lifetime Prediction of MOSFETs
Maxa, Jacob, Nowottnick, Mathias
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
Sattari, Romina, van Zeijl, Henk, Zhang, GuoQi
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Monolithic Ceramic IR-Emitter for Gas Analyzer
Goldberg, Adrian, Manhica, Birgit, Ziesche, Steffen, Ebermann, Martin, Gunther, Armin
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Corrosion effects and reliability improvement of silver wire bonded contacts in automotive application
Klengel, Robert, Klengel, Sandy, Schischka, Jan, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
High current transistor packaging for very low on-resistance
Jonsson, Tomas, Svensson, Christer, Drugge, Lars, Suriyamoorthy, Ghayathri
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Light Emitting Diodes selection for space applications based on the analysis of proton-induced damage
Vakili, Aref Eshkevar, Bassetti, Daniel, Bregoli, Matteo, LaMagna, Antonino, Mascali, David, Bellini, Vincenzo, Ficorella, Francesco, Ali, Omar Hammad, Buffardo, Mario, Finocchi, Daniele, Francola, Stefano, Cianci, Corrado
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Characterization of the corrosion behavior of Al-X bond wires
Kolbinger, E., Groth, A., Wagner, S., Schneider-Ramelow, M.
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
High Step Coverage Interconnects By Printed Nanoparticles
Ginkel, Hendrik Joost van, Romijn, Joost, Vollebregt, Sten, Zhang, Guo Qi
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
MEMS thermoelecctric multi-color photo-thermal detector
Liu, Zekun, Zhang, Shuai, Mu, Erzhen, Wu, Zhenhua, Yu, Duo, Chen, Tianyu, Hu, Zhiyu
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Control of Low Temperature Co-fired Ceramic Shrinkage for Unconstrained Sintering
Karnfelt, Camilla, Sinou, Maina
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies
Cekic, Serhat Y., Ergen, Arif, Tunc, Alperen
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Packaging Solution for RF SiP with on-top Integrated Antenna
Maierna, Amedeo, Gritti, Alex, Maggi, Luca, Sarto, Marco Del, Sanna, Aurora, Halicki, Damian, Graziosi, Giovanni
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Assembly of MEMS micro mirrors pair system in a single module
Sarto, Marco Del, Maggi, Luca, Gritti, Alex, Maierna, Amedeo, Terzi, Davide, Carminati, Roberto
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Optimized Packaging Solutions for Multi-Emitter Laser Modules
Pippione, Giulia, Codato, Simone, Maina, Alberto, Mirigaldi, Alessandro, Riva, Martina, Paoletti, Roberto
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding