Search Results - "2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)" :: K.UTB vyhledávací portál

A Novel Method for High Frequency Battery Impedance Measurements

by Landinger, Thomas F., Schwarzberger, Guenter, Jossen, Andreas
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Decoupling Capacitor Selection Algorithm for PDN Based on Deep Reinforcement Learning

by Zhang, Ling, Zhang, Zhongyang, Huang, Chenxi, Deng, Han, Lin, Hank, Tseng, Bin-Chyi, Drewniak, James, Hwang, Chulsoon
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Power Delivery Network Optimization Approach using an Innovative Hybrid Target Impedance

by Xu, Jun, Bai, Siqi, Nalla, Kartheek, Sapozhnikov, Mike, Drewniak, James L., Hwang, Chulsoon, Fan, Jun
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Comparative Analysis of Magnetic Materials, Coil Structures and Shielding Materials for Efficient Wireless Power Transfer

by Bima, Muhammad Enagi, Bhattacharya, Indranil, Hasan, Syed Rafay
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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A Method to Extract Physical Dipoles for Radiating Source Characterization and Near Field Coupling Estimation

by Wu, Chunyu, Sun, Ze, Huang, Qiaolei, Wang, Yansheng, Fan, Jun, Zhou, Jing
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Active Coil System for Magnetic Field Reduction in an Automotive Wireless Power Transfer System

by Campi, T., Cruciani, S., Maradei, F., Feliziani, M.
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Design and Analysis of MIM Capacitor on Power Integrity Effects for HPC and Network Applications

by Moon, Sungwook, Nam, Senungki, Kang, Minseok, Lee, Yongho
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Jitter-Aware Target Impedance

by Sun, Yin, Kim, Jingook, Hwang, Chulsoon
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Reciprocity Theorem Based RFI Estimation for Heatsink Emission

by Huang, Qiaolei, Zhong, Yang, Sun, Ze, Enomoto, Takashi, Seto, Shingo, Araki, Kenji, Fan, Jun, Hwang, Chulsoon
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Deep Learning Method for Prediction of Planar Radiating Sources from Near-Field Intensity Data

by Ma, Hanzhi, Li, Er-Ping, Schutt-Aine, Jose, Cangellaris, Andreas C.
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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EMC Analysis of Shielded Twisted Pair and Shielded Parallel Pair Transmission Lines for Automotive Multi-Gig Ethernet

by Mortazavi, Sanaz, Schleicher, Detlef, Stieler, Alexander, Sinai, Ali, Gerfers, Friedel, Hampe, Matthias
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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A Practical De-embedding Error Analysis Method Based on Statistical Circuit Models of Fixtures

by Yong, Shaohui, Liu, Yuanzhuo, Gao, Han, Hinaga, Scott, De, Soumya, Padilla, Darja, Yanagawa, Douglas, Drewniak, James, Khilkevich, Victor
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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A Novel System-Level Power Integrity Transient Analysis Methodology using Simplified CPM Model, Physics-based Equivalent Circuit PDN Model and Small Signal VRM Model

by Xu, Jun, Bai, Siqi, Zhao, Biyao, Nalla, Kartheek, Sapozhnikov, Mike, Drewniak, James L., Hwang, Chulsoon, Fan, Jun
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Causality Analyzing for Transmission Line with Surface Roughness

by Sun, Xinglin, Guo, Yuandong, Sun, Yin, Song, Kaichen, Ye, Lingyun, Ye, Xiaoning, Drewniak, James L., Fan, Jun
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Real-Time Circuit Reconfiguration for a Cognitive Software-Defined Radar Transmission: A New Paradigm in Spectrum Sharing

by Baylis, Charles, Egbert, Austin, Alcala-Medel, Jose, Dockendorf, Angelique, Martone, Anthony, Marks, Robert J.
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Shielding Effectiveness of Board Level Shields with Absorbing Materials

by Liu, Yuanzhuo, He, Ruijie, Khilkevich, Victor, Dixon, Paul
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Simulation and Characterization of Singing Capacitors in Consumer Electronics

by Lu, Tianjian, Ding, Mingyao, Wu, Ken
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Equivalent Inductance Analysis and Quantification for PCB PDN Design

by Ding, Yifan, Zhao, Biyao, Liang, Shuang, Bai, Siqi, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Scearce, Stephen, Li, Erping, Archambeault, B., Fan, Jun, Drewniak, James
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Bayesian Optimization for Stack-up Design

by Kiguradze, Zurab, He, Jiayi, Mutnury, Bhyrav, Chada, Arun, Drewniak, James
Published in 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (01.07.2019)

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Wireless Coexistence Testing in the 5 GHz Band with LTE-LAA Signals

by Kalaa, Mohamad Omar Al, Seidman, Seth J.
Published in IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.07.2019)

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