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Cryogenic Qubit Integration for Quantum Computing
Das, R N., Oliver, W.D., Yoder, J.L., Rosenberg, D., Kim, D.K., Yost, D., Mallek, J., Hover, D., Bolkhovsky, V., Kerman, A.J.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Fan-Out Panel Level Package with Fine Pitch Pattern
Jinyoung Kim, Ikjun Choi, Park, JunHyeong, Jae-Ean Lee, TaeSung Jeong, Jungsoo Byun, YoungGwan Ko, Kangheon Hur, Dae-Woo Kim, Kyung Suk Oh
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
Se-Ho You, Seonghwan Jeon, Dan Oh, Kilsoo Kim, Jaechoon Kim, Seung-Yong Cha, GyoungBum Kim
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions
Knickerbocker, John U., Budd, R., Dang, B., Chen, Q., Colgan, E., Hung, L.W., Kumar, S., Lee, K.W., Lu, M., Nah, J.W., Narayanan, R., Sakuma, K., Siu, V., Wen, B.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications
Kyoung-Lim Suk, Seok Hyun Lee, Jong Youn Kim, Seok Won Lee, Hak Jin Kim, Su Chang Lee, Pyung Wan Kim, Dae-Woo Kim, Dan Oh, Jung Soo Byun
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading
Chowdhury, Md Mahmudur, Hoque, Mohd Aminul, Fu, Nianjun, Suhling, Jeffrey C., Hamasha, Sa'd, Lall, Pradeep
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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High Performance, High Density RDL for Advanced Packaging
Yu, C. H., Yen, L. J., Hsieh, C. Y., Hsieh, J. S., Chang, Victor C. Y., Hsieh, C. H., Liu, C. S., Wang, C. T., Yee, Kc, Yu, Doug C. H.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric
Jangam, SivaChandra, Bajwa, Adeel Ahmed, Thankkappan, Kannan K., Kittur, Premsagar, Iyer, Subramanian Srikantes
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
Hong, Jisun, Choi, Kyoungsei, Oh, Dan, Park, S.B., Shao, Shuai, Wang, Huayan, Niu, Yuling, Pham, Van Lai
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application
Chen Zihao, Lim Teck Guan, Ho, David Soon Wee, Bhattacharya, Surya
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices
Sahasrabudhe, Shubhada, Mokler, Scott, Renavikar, Mukul, Sane, Sandeep, Byrd, Kevin, Brigham, Eric, Jin, Owen, Goonetilleke, Pubudu, Badwe, Nilesh, Parupalli, Satish
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling
Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, Seungbae Park, Hohyung Lee, Refai-Ahmed, Gamal, Yip, Laurene
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Panel Level Packaging - A View Along the Process Chain
Braun, Tanja, Becker, K-F, Hoelck, O., Kahle, R., Wohrmann, M., Boettcher, L., Topper, M., Stobbe, L., Zedel, H., Aschenbrenner, R., Voges, S., Schneider-Ramelow, M., Lang, K-D
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process
Wei-Chung Chen, Chiu-Wen Lee, Hung-Chun Kuo, Min-Hua Chung, Chaung-Chi Wang, Shang-Kun Huang, Yen-Sen Liao, Chen-Chao Wang, Tarng, David
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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A Novel Structure for Backside Protection Against Physical Attacks on Secure Chips or SiP
Borel, Stephan, Duperrex, L., Deschaseaux, E., Charbonnier, J., Clediere, J., Wacquez, R., Fournier, J., Souriau, J.-C, Simon, G., Merle, A.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Miniaturized High-Performance Filters for 5G Small-Cell Applications
Ali, Muhammad, Fuhan Liu, Watanabe, Atom, Raj, P. Markondeya, Sundaram, Venkatesh, Tentzeris, Manos M., Tummala, Rao R.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal Cycling
Hamasha, Sa'd, Akkara, Francy, Abueed, Mohammed, Rababah, Mumen, Zhao, Cong, Su, Sianan, Suhling, Jeffery, Evans, John
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO Packaging
Han-Ping Pu, Kuo, H. J., Liu, C. S., Yu, Douglas C. H.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration
Shuying Ma, Jiao Wang, Fengxia Zheng, Zhiyi Xiao, Teng Wang, Daquan Yu
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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