The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer
Sergkei, Kamotesov, Lombard, Philippe, Semet, Vincent, Allard, Bruno, Moguedet, Mael, Cabrera, Michel
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures
Graf, Daniel, Neermann, Simone, Stuber, Lisa, Scheetz, Matthias, Franke, Jorg
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Optimized Thermoforming Process for Conformable Electronics
Kallmayer, Christine, Schaller, Florian, Loher, Thomas, Haberland, Julian, Kayatz, Fabian, Schult, Andre
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID
Soltani, Mahdi, Liu, Yunsi, Zimmermann, Andre, Kulkarni, Romit, Barth, Maximilian, Groezinger, Tobias
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
Ankenbrand, Markus, Scheetz, Matthias, Franke, Joerg, Lomakin, Konstantin, Sippel, Mark, Gold, Gerald, Helmreich, Klaus
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices
Ermantraut, Eugen, Zimmermann, Andre, Muller, Hagen, Wolf, Marius, Eberhardt, Wolfgang, Ninz, Philipp, Kern, Frank, Gadow, Rainer
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Influences of Manufacturing Sequences for the Application of Printed Electronics on Aircraft Interior Components
Ischdonat, Nils, Dreyer, Christian, Graf, Daniel, Franke, Jorg, Horber, Johannes, Hedges, Martin
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes
Schirmer, Julian, Eisen, Kilian, Reichenberger, Marcus, Roudenko, Jewgeni, Neermann, Simone, Franke, Jorg
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Laser Assisted Selective Metallization of Polymers
Ratautas, Karolis, Jagminiene, Aldona, Stankeviciene, Ina, Norkus, Eugenijus, Raciukaitis, Gediminas
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Long Term Reliability of Mechatronic Devices Generated by Fused Layer Modeling and Laser Assisted Sintering of Printed Structures
Niese, Bernd, Geisler, Bastian, Frick, Thomas, Roth, Stephan, Schmidt, Michael
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing
Wolf, Marius, Janek, Florian, Meisner, Thomas, Wigger, Benedikt, Barth, Maximilian, Gunter, Thomas, Eberhardt, Wolfgang, Zimmermann, Andre, Geneis, Volker, Luke, Tobias, Hedayat, Christian, Otto, Thomas
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Limits of ceramics in the 3D-MID with additively produced aluminum substrate
Gotze, Elisa, Postler, Kevin, Buschulte, Stefan, Zanger, Frederik, Schulze, Volker
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Applications of Three Dimensional Laser Induced Metallization Technology with Polymer Coating
Chieh Yang, Min-Chieh Chou, Tune-Hune Kao, Meng-Chi Huang
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Effect of talc on the metal adhesion of laser-structured polymer parts
Fischer, Andreas J., Drummer, Dietmar, Kuhn, Thomas, Franke, Jorg
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Integration of electronic components in the thermoplastic processing chain: possibilities through additive manufacturing using conductive materials
Morais, Manuel V. C., Reidel, Robin, Weiss, Patrick, Baumann, Sascha, Hubner, Christof, Henning, Frank
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Electrical and Mechanical Qualification of Selectively Dispensed Active Brazes
Stoll, Thomas, Franke, Joerg
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Low-Temperature Sintering of Nanometal Inks on Polymer Substrates
Keck, Jurgen, Freisinger, Birger, Juric, Daniel, Glaser, Kerstin, Volker, Martin, Eberhardt, Wolfgang, Zimmermann, Andre
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
Cu Paste for Molded Interconnect Devices
Ejiri, Yoshinori, Sukata, Shinichirou, Toba, Masaya, Urashima, Kosuke, Yonekura, Motoki, Noudou, Takaaki, Kurihara, Yoshiaki, Masuda, Hiroshi
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding
New standards for 3D-userinterfaces-manufactured by a Film Insert Molding process
Wimmer, Annette, Reichel, Herbert, Schmidt, Klaus
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
Published in 2018 13th International Congress Molded Interconnect Devices (MID) (01.09.2018)
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Conference Proceeding