Bending machine for testing reliability of flexible electronics
Wright, Daniel Nilsen, Vardoy, Astrid-Sofie B., Belle, Branson D., Visser Taklo, Maaike M., Hagel, Olle, Xie, Li, Danestig, Magnus, Eriksson, Torbjorn
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Effect of sintering method on properties of nanosilver paste
Qiaoran Zhang, Jiawen Liu, Wei Ke, Shirong Huang, Gutierrez Latorre, Marti, Nan Wang, Xiuzhen Lu, Lilei Ye, Johan Liu
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
RF modules (Tx-Rx) with multifunctional MMICs
Oppermann, Martin, Rieger, Ralf
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
Yang, Yiqun, Ye, Hui, Ke, Wei, Huang, Shirong, Wang, Nan, Lu, Xiuzhen, Bao, Jie, Ye, Lilei, Liu, Johan
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
An overview of carbon nanotubes based interconnects for microelectronic packaging
Shujing Chen, Bo Shan, Yiqun Yang, Guangjie Yuan, Shirong Huang, Xiuzhen Lu, Yan Zhang, Yifeng Fu, Lilei Ye, Johan Liu
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials
Satwara, Maulik, Hansson, Josef, Lilei Ye, Rhedin, Henric, Liu, Johan
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Graphene-based heat spreading materials for electronics packaging applications
Guangjie Yuan, Bo Shan, Shujing Chen, Yiqun Yang, Jie Bao, Nan Wang, Peng Su, Shirong Huang, Yong Zhang, Lilei Ye, Johan Liu
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
Shirong Huang, Wei Ke, Yiqun Yang, Hui Ye, Shujing Chen, Bo Shan, Jie Bao, Qianlong Wang, Guangjie Yuan, Xiuzhen Lu, Yan Zhang, Yifeng Fu, Lilei Ye, Liu, Johan
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Fabrication and characterization of graphene based film
Yuqing Shi, Ye, Lilei, Zehri, Abdel Hafid, Logothetis, Nikolas, Peng Su, Nan Wang, Liu, Johan
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Low temperature and high quality atomic layer deposition HfO2 coatings
Perros, Alexander Pyymaki, Sippola, Perttu, Arduca, Elisa, Johansson, Leena-Sisko, Lipsanen, Harri
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Fabrication and characterization of screen printed stretchable carbon interconnects
Mosallaei, Mahmoud, Khorramdel, Behnam, Honkanen, Mari, Iso-Ketola, Pekka, Vanhala, Jukka, Mantysalo, Matti
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
R2R process for integrating LEDs on flexible substrate
Juntunen, Eveliina, Ihme, Sami, Huttunen, Arttu, Makinen, Jukka-Tapani
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Thermal effects in a printed circuit board due to heat emission from mounted components
Lakshminarayanan, V., Soundarakumar, M.
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, Selin Tolunay, Goritz, Alexander, Wietstruck, Matthias, Cirillo, Maurizio, Wipf, Christian, Zoschke, Kai, Kaynak, Mehmet
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Direct copper metallization on glass technology + x-substrate
Onitake, Shigeo, Onishi, Tetsuya
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Ag sinter joining and wiring for high power electronics
Suganuma, K., Asatani, N., Kimoto, K., Suetake, A., Zhang, H., Nagao, S., Sugahara, T.
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Optimized thermal management system of Modular Multilevel Converter for HVDC applications
Hajizadeh, Amin
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Enhanced heat transport in printed circuit boards via passive components embedding
de Sousa, Jonathan Silvano, Fulmek, Paul, Unger, Michael, Haumer, Peter, Nicolics, Johann
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
Chip package interaction with Cu Pillar interconnects - systematic study of key factors impacting the qualification
Boehme, Bjoern, Breuer, Dirk, Goetze, Christian, Estoque, Al Rhea, Tischer, Falk, Kuechenmeister, Frank, Paul, Jens, Thiele, Michael
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding
SMARTER-SI - Smart access to manufacturing for Systems Integration
Andersson, Dag, Weiler, Petra, Mayora, Kepa, Kunze, Michael, Gunzler, Rainer, Karmann, Stephan, Steinke, Arndt, Winzer, Andreas, Thronicke, Nicole, Vazquez, Patricia, Felemban, Shifa, Moore, Eric, Voirin, Guy, Scolan, Emmanuel, Smadja, Rita
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Get full text
Conference Proceeding