Warpage simulation and experiment for panel level fan-out package
Tingyu Lin, Fengze Hou, Haiyan Liu, Daicong Pan, Feng Chen, Jun Li, Hengyun Zhang, Liqiang Cao
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Compact power electronic modules realized by PCB embedding technology
Loher, Thomas, Karaszkiewicz, Stefan, Bottcher, Lars, Ostmann, Andreas
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Glass interposer technology advances for high density packaging
Kuramochi, Satoru, Kudo, Hiroshi, Akazawa, Miyuki, Mawatari, Hiroshi, Tanaka, Masaya, Fukuoka, Yoshitaka
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Potential and challenges of fan-out panel level packaging
Braun, Tanja, Becker, Karl-Friedrich, Kahle, Ruben, Raatz, Stefan, Topper, Michael, Aschenbrenner, Rolf, Voges, Steve, Wohrmann, Markus, Lang, Klaus-Dieter
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Validated simulation of the ultrasonic wire bonding process
Unger, Andreas, Schemmel, Reinhard, Meyer, Tobias, Eacock, Florian, Eichwald, Paul, Althoff, Simon, Sextro, Walter, Brokelmann, Michael, Hunstig, Matthias, Guth, Karsten
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Evaluation of optical coupling characteristics for optoelectronic hybrid LSI package
Noriki, A., Amano, T., Mori, M., Sakakibara, Y., Kurata, K., Ukita, A., Kurihara, M., Takemura, K.
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
"The latest package and assembly technology for SiC power module"
Takahashi, Yoshikazu, Nogawa, Hiroyuki, Morozumi, Akira, Nishimura, Yoshitaka
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Photosensitive polyimide adhesive sheet
Tomikawa, Masao, Matsumura, Kazuyuki, Koyama, Yutaro, Ikeda, Yoshifumi, Tatsuta, Yoshiko, Yu Shoji
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
28-Gb/s ×4-channel solderable optical transceiver module for QSFP28
Nasu, Hideyuki, Nagashima, Kazuya, Ishikawa, Yozo, Izawa, Atsushi, Nekado, Yoshinobu, Kise, Tomofumi
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Thermal design of 28-Gb/s × 24-channel CDR-integrated VCSEL-based transceiver module
Uemura, Toshinori, Nagashima, Kazuya, Nishimura, Naoya, Izawa, Atsushi, Ishikawa, Yozo, Nasu, Hideyuki
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Advanced packaging technologies supporting new semiconductor application
Ooida, Mitsuru, Taniguchi, Fumihiko, Iwasaki, Toshihiro, Ono, Akinori, Asano, Yuichi, Hiruta, Yoichi
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Micro wear modeling in copper wire wedge bonding
Eichwald, Paul, Unger, Andreas, Eacock, Florian, Althoff, Simon, Sextro, Walter, Guth, Karsten, Brokelmann, Michael, Hunstig, Matthias
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Multimode polymer optical waveguide with over-crossing structures enabling high-density on-board integration
Yamauchi, Akira, Taira, Yoichi, Ishigure, Takaaki
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Printing and application of flexible and sodlerable electrodes for LED sheets
Sakai, Yuichi, Honda, Ken-ichi, Shinohara, Orie, Kizawa, Hiroshi, Hirose, Keiichi
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Multi-core optical fibers realizing high-density/-capacity transmissions
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Conference Proceeding
Integrated optic device for narrow-band reflection and guided-wave launching
Tsuji, Atsushi, Inoue, Junichi, Nishio, Kenzo, Ura, Shogo, Kintaka, Kenji
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding