Impact wear and other contact effects on the electro-mechanical reliability of MEMS
De Pasquale, G., Soma, A., Barbato, M., Meneghesso, G.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Design and test of resonators using PiezoMUMPS technology
Pons-Nin, Joan, Gorreta, Sergi, Dominguez, Manuel, Blokhina, Elena, O'Connell, Diarmuid, Feely, Orla
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Publication
A comparative study of reduced-order modeling techniques for nonlinear MEMS beams
Juillard, Jerome
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Design and optimization of a low-voltage shunt capacitive RF-MEMS switch
Ma Li Ya, Soin, Norhayati, Nordin, Anis Nurashikin
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Design and fabrication of driving microcoil with large tilt-angle for medical scanner application
Bin Sun, Sawada, Renshi, Zhuoqing Yang, Yi Zhang, Itoh, Toshihiro, Maeda, Ryutaro
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Flexible current clamp sensor using screen-printed coil
Yamashita, Takahiro, Yi Zhang, Itoh, Toshihiro, Maeda, Ryutaro
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Fabrication and micromechanical characterization of polycrystalline diamond microcantilevers
Possas, Maira, Rousseau, Lionel, Ghassemi, Farbod, Lissorgues, Gaelle, Scorsone, Emmanuel, Bergonzo, Philippe
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Remote power feed and control of MEMS with 58 V silicon photovoltaic cell made by a CMOS post-process dry release and device isolation method
Mori, Isao, Kubota, Masanori, Lebrasseur, Eric, Mita, Yoshio
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
A dual-axis MEMS inertial sensor using multi-layered high-density metal for an arrayed CMOS-MEMS accelerometer
Yamane, Daisuke, Matsushima, Takaaki, Konishi, Toshifumi, Toshiyoshi, Hiroshi, Machida, Katsuyuki, Masu, Kazuya
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Design and analysis of polysilicon thin layers and MEMS vibrating structures
Voicu, Rodica, Gavrila, Raluca, Obreja, Cosmin, Muller, Raluca, Baracu, Angela, Michalowski, Marcin, Rymuza, Zygmunt
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
Lucibello, A., Capoccia, G., Proietti, E., Marcelli, R., Margesin, B., Mulloni, V., Giacomozzi, F., Vitulli, F., Scipioni, M., Bartolucci, G.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Constructing high-power LED lamp model to evaluate different heat dissipation mechanism design
Ming-Tzer Lin, Yi-Sheng Liao, Hsu, F.-C, Wang, Y.-T, Kao, Han, De-Shau Huang
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Analysis of electromechanical coupling coefficient of surface acoustic wave resonator in ZnO piezoelectric thin film structure
Binti Md. Ralib Raghib, Aliza Aini, Nordin, Anis Nurashikin
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Accurate 3D reconstruction of silicon micro/nanostructures, based on high resolution FIB-SEM tomography: Application to Black Silicon
Saab, D. Abi, Basset, P., Marty, F., Angelescu, D. E., Trawick, M.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Low-noise CMOS amplifier for readout electronic of resistive NEMS audio sensor
Nebhen, J., Savary, E., Rahajandraibe, W., Dufaza, C., Meillere, S., Kussener, E., Barthelemy, H., Czarny, J., Lhermet, H.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Design and FEM modeling of notch effect in gold microbeams
Saleem, M. M., Soma, A., De Pasquale, G.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Collection of magnetic particles from synovial fluid using Nd-Fe-B micromagnets
Garraud, A., Kozissnik, B., Velez, C., Yarmola, E. G., Maldonado-Camargo, L., Rinaldi, C., Allen, K. D., Dobson, J., Arnold, D. P.
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Piezoelectric PVDF film switch to activate event-driven system for chicken health monitoring
Nogami, Hirfoumi, Okada, Hironao, Takamatsu, Seiichi, Kobayashi, Takeshi, Maeda, Ryutaro, Itoh, Toshihiro
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding
Developing MEMS DC electric current sensor for end-use monitoring of DC power supply: Part IV - Cantilever-based magnetic field sensor device
Terasawa, Daisuke, Wang, Dong F., Kizaki, Takahiro, Itoh, Toshihiro, Maeda, Ryutaro
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Get full text
Conference Proceeding