Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Beilliard, Y., Signamarcheix, T., Moreau, S., Cioccio, L. Di, Coudrain, P., Romano, G., Nowodzinski, A., Aussenac, F., Jouneau, P.-h., Rolland, E.
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Thermal performance of 3D ICs: Analysis and alternatives
Santos, Cristiano, Vivet, Pascal, Colonna, Jean-Philippe, Coudrain, Perceval, Reis, Ricardo
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV
Lee, K. W., Nagai, C., Nakamura, A., Bea, J. C., Murugesan, M., Fukushima, T., Tanaka, T., Koyanagi, M.
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Using TSVs for thermal mitigation in 3D circuits: Wish and truth
Santos, Cristiano, Momar Souare, Papa, de Crecy, Francois, Coudrain, Perceval, Colonna, Jean-Philippe, Vivet, Pascal, Borbely, Andras, Reis, Ricardo, Ben Jamaa, Haykel, Fiori, Vincent, Farcy, Alexis
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Fault localisation of defects using Electro Optical Terahertz Pulse Reflectometry and 3D EM modelling with Virtual Known Good Device
Kowalczuk, Emma, Bhattacharya, Arnab, Ka Chung Lee, Alton, Jesse, Igarashi, Martin, Barbeau, Stephane
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges
De Vos, Joeri, Cherman, Vladimir, Detalle, Mikael, Teng Wang, Salahouelhadj, Abdellah, Daily, Robert, Van der Plas, Geert, Beyne, Eric
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Analysis of thermal stress distribution for TSV with novel structure
Wei Feng, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
A built-in supply current test circuit for electrical interconnect tests of 3D ICs
Hashizume, Masaki, Umezu, Shoichi, Yotsuyanagi, Hiroyuki, Shyue-Kung Lu
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Design rule check and layout versus schematic for 3D integration and advanced packaging
Fischbach, Robert, Heinig, Andy, Schneider, Peter
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Characterization of particle beds in percolating thermal underfills based on centrifugation
Zimmermann, Severin, Brunschwiler, Thomas, Burg, Brian R., Zuercher, Jonas, Guo Hong, Poulikakos, Dimos, Baum, Mario, Hofmann, Christian
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Thermal implications of mobile 3D-ICs
Saeidi, Mehdi, Samadi, Kambiz, Mittal, Arpit, Mittal, Rajat
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Fault detection and isolation of multiple defects in through silicon via (TSV) channel
Jung, Daniel H., Heegon Kim, Kim, Jonghoon J., Sukjin Kim, Kim, Joungho, Hyun-Cheol Bae, Kwang-Seong Choi
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Sitaraman, Srikrishna, Sundaram, Venky, Tummala, Rao
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal
Watanabe, Naoya, Aoyagi, Masahiro, Katagawa, Daisuke, Bandoh, Tsubasa, Mitsui, Takahiko, Yamamoto, Eiichi
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer
Dieng, Khadim, Artillan, Philippe, Bermond, Cedric, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Lamy, Yann, Flechet, Bernard
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Analysis of 3D interconnect performance: Effect of the Si substrate resistivity
Sun, X., Van der Plas, G., Detalle, M., Beyne, E.
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test
Temple, Dorota S., Malta, Dean, Vick, Erik P., Lueck, Matthew R., Goodwin, Scott H., Muzilla, Mark S., Masterjohn, Christopher M., Skokan, Mark R.
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Advanced processing for high efficiency inductors for 2.5D/3D Power Supply in Package
Anthony, Ricky, Kulkarni, Santosh, Ningning Wang, Mathuna, Cian O.
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits
Harris, T. Robert, Franzon, Paul, Davis, W. Rhett, Lee Wang
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack
Matsumoto, Keiji, Mori, Hiroyuki, Orii, Yasumitsu
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding