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Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique
Stoukatch, S., Laurent, P., Dricot, S., Axisa, F., Seronveaux, L., Vandormael, D., Beeckman, E., Heusdens, B., Destine, J.
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
Vandevelde, Bart, Willems, Geert
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Characterization of hermetic wafer-level Cu-Sn SLID bonding
van de Wiel, H. J., Vardoy, A-S. B., Hayes, G., Fischer, H. R., Lapadatu, A., Taklo, M. M. V.
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Development of embedded power electronics modules
Boettcher, Lars, Karaszkiewicz, Stefan, Manessis, Dionysios, Ostmann, Andreas
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications
Jourdain, A., Phommahaxay, A., Verbinnen, G., Suhard, S., Miller, A., Manna, A. La, Swinnen, B., Beyer, G., Beyne, E.
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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A built-in test circuit for supply current testing of open defects at interconnects in 3D ICs
Konishi, Tomoaki, Yotsuyanagi, Hiroyuki, Hashizume, Masaki
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Reliability assessment of MEMS devices - A case study of a 3 axis gyroscope
Makkonen, Joonas, Broas, Mikael, Li, Jue, Hokka, Jussi, Mattila, Toni T., Paulasto-Krockel, Mervi
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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High density 3D silicon interposer technology development and electrical characterization for high end applications
Charbonnier, Jean, Assous, Myriam, Bally, Jean-Philippe, Miyairi, Ken, Sunohara, Masahiro, Cuchet, Robert, Feldis, Helene, Bouzaida, Nicole, Bernard-Henriques, Nathalie, Hida, Rachid, Mourier, Thierry, Simon, Gilles, Higashi, Mitsutoshi
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Synergy between 2.5/3D development and hybrid 3D Wafer Level Fanout
Hunt, John, Ding, Y. C., Hsieh, Adren, Chen, Jason, Huang, Dinos
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Reliable HT electronic packaging - Optimization of a Au-Sn SLID joint
Tollefsen, Torleif A., Taklo, Maaike M. Visser, Aasmundtveit, Knut E., Larsson, Andreas
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Reducing the bond frame width in Cu/Sn SLID wafer level packaging
Duan, Ani, Wang, Kaiying, Aasmundtveit, Knut E., Hoivik, Nils
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Influence of Cu joining partner in transient liquid phase bonding
Brem, Franziska, Liu, Chunlei, Raik, Deborah
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Cauwe, Maarten, Vandecasteele, Bjorn, De Baets, Johan, van den Brand, Jeroen, Kusters, Roel, Sridhar, Ashok
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Effects of bonding pressure on quality of SLID interconnects
Panchenko, Iuliana, Grafe, Juergen, Mueller, Maik, Wolter, Klaus-Juergen
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Plasma dicing technology
Matsubara, Noriyuki, Windemuth, Reinhard, Mitsuru, Hiroshima, Atsushi, Harikai
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Design and fabrication of a scalable high-reliability vacuum sealed package for infrared detectors
Fisette, B., Chevalier, C., Lepine, A., Boucher, M. A., Larouche, C., Tremblay, M., Lemieux, D., Tremblay, L. P., Dufour, D., Desroches, Y., Topart, P., Chateauneuf, F.
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Numerical simulation and experimental verification of copper plating with different additives for through silicon vias
Song, Chongshen, Wu, Heng, Jing, Xiangmeng, Dai, Fengwei, Yu, Daquan, Wan, Lixi
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections
Civale, Yann, Redolfi, Augusto, Velenis, Dimitrios, Heylen, Nancy, Beynet, Julien, Jung, InSoo, Woo, Jeong-Jun, Swinnen, Bart, Beyer, Gerald, Beyne, Eric
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Significant reduction of crossing loss using polynorbornene based GI-core optical waveguide
Takayama, S., Moriya, K., Mori, T., Choki, K.
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Hybrid in-mould integration for novel electrical and optical features in 3D plastic products
Alajoki, Teemu, Koponen, Matti, Tuomikoski, Markus, Heikkinen, Mikko, Keranen, Antti, Keranen, Kimmo, Makinen, Jukka-Tapani, Aikio, Janne, Ronka, Kari
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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