High-density silicon carrier transmission line design for chip-to-chip interconnects
Xiaoxiong Gu, Turlapati, Lavanya, Bing Dang, Tsang, Cornelia K., Andry, Paul S., Dickson, Timothy O., Beakes, Michael P., Knickerbocker, John U., Friedman, Daniel J.
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
High-frequency through-silicon Via (TSV) failure analysis
Joohee Kim, Jonghyun Cho, Jun So Pak, Joungho Kim, Jong-Min Yook, Jun Chul Kim
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Through-silicon via (TSV) depletion effect
Jonghyun Cho, Myunghoi Kim, Joohee Kim, Jun So Pak, Joungho Kim, Hyungdong Lee, Junho Lee, Kunwoo Park
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
A de-embedding method for extracting S-parameters of vertical interconnect in advanced packaging
Yin-Cheng Chang, Hsu, Shawn S. H., Da-Chiang Chang, Jeng-Hung Lee, Shuw-Guann Lin, Ying-Zong Juang
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Electrical performance of inkjet printed flexible cable for ECG monitoring
Qiansu Wan, Geng Yang, Qiang Chen, Li-Rong Zheng
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Embedded equalization for ADC-based serial I/O receivers
Shafik, Ayman, Keytaek Lee, Tabasy, Ehsan Zhian, Palermo, Samuel
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Macromodeling based variability analysis of an inverted embedded microstrip line
Vande Ginste, Dries, De Zutter, Daniel, Deschrijver, Dirk, Dhaene, Tom, Canavero, Flavio
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Adaptive clock distribution for 3D integrated circuits
Xi Chen, Davis, W. Rhett, Franzon, Paul D.
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Temperature-dependent through-silicon via (TSV) model and noise coupling
Manho Lee, Jonghyun Cho, Joohee Kim, Jun So Pak, Joungho Kim, Hyungdong Lee, Junho Lee, Kunwoo Park
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
An explicit and unconditionally stable time-domain finite-element method of linear complexity for electromagnetics-based simulation of 3-D global interconnect network
Qing He, Duo Chen, Dan Jiao
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Signal-integrity improvement based on the segmental-transmission-line
Shimada, Hiroki, Akita, Shohei, Ihiguro, Masami, Yasunaga, Moritoshi, Yoshihara, Ikuo
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Distributed multi TSV 3D clock distribution network in TSV-based 3D IC
Dayoung Kim, Joohee Kim, Jonghyun Cho, Jun So Pak, Joungho Kim, Hyungdong Lee, Junho Lee, Kunwoo Park
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding
Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance
Hanfeng Wang, Ruehli, Albert E., Jun Fan
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
Published in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2011)
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Conference Proceeding