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Tin whisker growth from Sn-Cu (0-5 wt%) surface finishes
Illes, Balazs, Horvath, Barbara, Shinohara, Tadashi, Harsanyi, G.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Accelerated ageing tests for predicting capacitor lifetimes
Jano, R., Pitica, D.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Energy efficient routing protocols for Wireless Sensor Networks: A survey
Cirstea, C.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Designing low cost embedded systems with ethernet connectivity
Drumea, A., Svasta, P.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Soldering profile optimization for vapour phase reflow technology
Geczy, A., Szoke, P., Illyefalvi-Vitez, Z., Ruszinko, M., Bunea, R.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Secret data communication system using steganography, AES and RSA
Mare, S. F., Vladutiu, M., Prodan, L.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Simulation of a wireless sensor network using OPNET
Marghescu, C., Pantazica, M., Brodeala, A., Svasta, P.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Development of SAW filters based on GaPO4
Schiopu, P., Cristea, I., Grosu, N., Craciun, A.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Influence of quantization errors on the development of vector modulator based phaseshifter for use in smart antenna applications
Manu, O., Dimian, M., Graur, A.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Design of Anti Burglar Alarm Systems detection and signaling
Schiopu, Paul, Costea, Aurelian
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Data Matrix Code - A reliable optical identification of microelectronic components
Dita, I., Otesteanu, M., Quint, F.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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About the negative permittivity of some metamaterial composites - Simulational study
Ionescu, D., Kovaci, M.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Communication control system implemented in FPGA
Lung, Claudiu, Sabou, Sebastian, Orha, Ioan
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Multipoint wireless measurement system with LabVIEW interface
Visan, D. A., Lita, I.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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A Petri net approach to multicellular chopper control
Florea, B. C., Stoichescu, D. A., Stefanescu, V.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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On pinnae design and fabrication technology
Epure, S., Aiordachioaie, D.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Influence of thermal aging on the reliability of electrically conductive adhesives
Barto, S., Cinert, J., Mach, P.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Storage and usage system of electrostatic energy with EDCL
Brodeala, A., Vasile, A., Svasta, P., Mihailescu, B.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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Key-word data base used in communication system with disabled people
Cehan, D. A., Lupu, R., Cehan, V., Bozomitu, R. G.
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
Published in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (01.10.2011)
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