FMEA/PFMEA : What they never teach you in formal school
Shridhar, Shankar
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
The challenges of high density wires in C45SOI 40µm package
Yew, Low Boon, Teck, Siong Chin
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Small signal electrical testing in package engineering
Liu, C S
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
FMEA/PFMEA : What they never teach you in formal school
Shridhar, Shankar
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Get full text
Conference Proceeding
Past, present and future of electronic packaging
Fjelstad, Joseph
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Ultra low CTE (0 PPM/C) polyimide film and its potential application
Tsukada, Yutaka
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Advanced copper wire bonding technology
Ho, Hong Meng
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Heterogeneous integration - A key enabling technology
Aschenbrenner, Rolf
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Design and modelling of a 40W microwave switch in QFN 2×2 package
Chin-Leong Lim
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
State-of-the-art and trends in 3D IC/Si integrations and WLP
Lau, John H
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
The practice of engineering in the year of the tiger
Chen, William
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Current technology barriers and future direction for packaging
Tsukada, Y
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Packaging trends in mobile electronics - Towards wafer level packaging
Baraton, Xavier
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
The importance of reliability in electronics
Fjelstad, Joseph
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
2nd level reliability drop test robustness for Wafer Level Packages
Queck Kian Pin, Ludwig, Heitzer, Yong Wei Wei
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Innovation and collaboration - Keeping up with market demands and transitions
Hyland, Kim
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Evolutionary development of wafer level packaging
Hunt, John
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Evolutionary development of Wafer Level Packaging
Hunt, J
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Cu wire bonding on Cu-Ni-Pd bond pad and leads: From development to robust production
Said, Hanafi
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding