Electromigration modeling with consideration of hillock formation
Yuan Xiang Zhang, Lihua Liang, Yong Liu
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Electro-thermo-mechanical simulation of automotive MOSFET transistor
Feral, Herve, Chauffleur, Xavier, Fradin, Jean-Pierre
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Virtual thermo-mechanical prototyping for high-temperature-application microelectronics
Daoguo Yang, van Driel, W D, Scholten, Huib, Goumans, L, Faria, R
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Computer simulation and design of a solder joint vibration test machine
Kamara, Elisha, Hua Lu, Bailey, Chris, Hunt, Chris, Di Maio, Davide, Thomas, Owen
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Mechanical and thermal simulations of a microactuator for the Stimulation of the Perilymph
Creutzburg, T, Gatzen, H H
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Modeling the effects of the PCB motion on the response of microstructures under mechanical shock
Ramini, Abdallah H, Younis, Mohammad I, Miles, Ronald
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Thermomechanical characterization of electronic components
Ben Khlifa, Sana, Bonfoh, Napo, Lipinski, Paul, Fendler, Manuel, Bernabe, Stephane, Ribot, Herve
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures
Naumann, F., Moutanabbir, O., Reiche, M., Schriever, C., Schilling, J., Petzold, M.
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Toward comprehensive reliability testing of electronic component boards
Mattila, T T, Paulasto-Krockel, M
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Thermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering
Bouwstra, Siebe, Hageman, Remco
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Design of Al pad geometry for reducing current crowding effect in flip-chip solder joint using finite-element analysis
Chang, Y W, Chih Chen
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Multiscale approach optimization on surface wettability change on rough surface
Chan, Edward K L, Haibo Fan, Yuen, Matthew M F
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure
Belov, Ilja, Lindgren, Mats, Ryden, Jan, Alavizadeh, Zahra, Leisner, Peter
Published in IEEE EuroSimE 2010, 26-28 April, Bordeaux, France (01.04.2010)
Published in IEEE EuroSimE 2010, 26-28 April, Bordeaux, France (01.04.2010)
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Conference Proceeding
Global modelling and simulation of a Coriolis vibrating micro-gyroscope for quadrature error compensation
Descharles, Melanie, Guerard, Jean, Kokabi, Hamid
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
MEMS resonator temperature compensation
Casset, F, Durand, C, Civet, Y, Ollier, E, Carpentier, J F, Ancey, P, Robert, P
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding