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Electrical characterization of sidewall insulation layer of TSV
Xin Sun, Ming Ji, Shenglin Ma, Yunhui Zhu, Wenping Kang, Min Miao, Yufeng Jin
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Reliability characterisation of Bi-modal high temperature stable Isotropic Conductive Adhesives
Wenkai Tao, Si Chen, Xiaohua Liu, Huiwang Cui, Tianan Chen, Liu, Johan
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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CMOS wafer bonding for back-side illuminated image sensors fabrication
Dragoi, V, Filbert, A, Zhu, S, Mittendorfer, G
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Carbon nanotube enhanced thermally and electrically conductive adhesive for advanced packaging
Xinhe Tang, Reiter, Werner, Meyer, Andreas, Tse, Kalvin Ka Chun, Hammel, Ernst
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Advanced reliability study on high temperature automotive electronics
Daoguo Yang, Dongjing Liu, van Driel, W D, Scholten, Huib, Goumans, L, Faria, R
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Metal surface cleanliness and its improvement on bonding
Ying-Hui Wang, Suga, T
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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An analysis of local deformation of SnAgCu solder joint using digital image correlation
Nobuyuki Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Noriyuki Miyazaki, Noriyuki, Hua Lu, Bailey, C, Thomas, O, Di Maio, Davide, Hunt, C
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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A verification of application specific component qualification
Challa, V, Pecht, M, Shilin Liu, Qiang Yu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Mechanical characterization of the IMC layer by using Nano-indentation tests
Yuan Guozheng, Li Zhigang, Shu Xuefeng
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Reliability study of stretchable electronics interconnect by simulation
Quayle Chen, Anping Zhao, Leon Xu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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3D modeling and finite-element full-wave simulation of TSV for stack up SIP integration applications
Min Miao, Lei Liang, Zhensong Li, Bo Han, Xin Sun, Yufeng Jin
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging
Kewei Chen, Rong Zhang, Lee, S W Ricky
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation
Zhaohui Chen, Xiaobing Luo, Sheng Liu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Thermal aging of molding compounds
Jansen, K M B, de Vreugd, J, Ernst, L J, Bohm, C
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Focused ion beam technology and application in failure analysis
Yuan Chen, Xiaowen Zhang
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding