by Daming Chen, Yingli Liu, Yuanxun Li, Wenguo Zhong, Dafu Lu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Kwang-Seong Choi, Sun-Woo Choo, Jong-Jin Lee, Ki-Jun Sung, Hyun-Chel Bae, Byeong-Ok Lim, Jong-Tae Moon, Yong-Sung Eom
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Siew Hoon Ore, Poh, S W Edith, Zhu, W H, Yuan, W L, Suthiwongsunthorn, Nathapong
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Arruda, Luciano, Ferreira, Willy, Andolfatto, Marco
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Yingli Liu, Yuanxun Li, Yunsong Xie, Huaiwu Zhang, Daming Chen, Jie Li
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Wei Tan, Hongjun Liu, Kok-Soo Goh, Hongjie Liu, Xingming Cheng
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Chenxi Wang, Chunqing Wang
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Shengjun Zhou, Qin Zhang, Bin Cao, Sheng Liu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Lu Guoguang, Huang Yun, En Yunfei
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Zhang Hongwu, Sun Fenglian, Liu Yang
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Yao Xiaohu, Fan Zerui, Yuan Miaomiao, Zhang Xiaoqing, Li Zhiqiang, Han Qiang
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Yuan Yuan, Min Ding, Chopin, Sheila
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Xiang Li, Zewen Liu, Zheng Wang, Yongqiang Huang, Ling Li
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Kelly, Robert, Jian Gao, Zhi Jun Yang, Xin Chen
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Jiaopin Wang, Kailin Pan, Jing Liu, Weitao Zhu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Wang, Shun, Zhang, Y., Hu, Zhili, Liu, Johan
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Baomin Wang, Liangliang Li
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Zhou Zhang, Yuliang Deng, Yunlong Liu, Yufeng Jin
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Chien-Hui Lu, Wei-Fu Chang
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)

by Xudong, Li, Yue Jin, Li, Meng Jiang, Xing
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)