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Experimental research of micro-channel cooler
Li Zongshuo, Wang Xiaojing, Wang Dianxiao, Wang Jia
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Analysis of the phenomenon of falling off of indium bumps from substrate during reflow process
Qiuping Huang, Dongliang Wang, Gaowei Xu, Yuan Yuan, Quan Wang, Le Luo
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Multi-scale modeling of moisture transfer in electronic packaging
Fan, H B, Yuen, Matthew M F
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Novel millimeter wave power-combining system in 3-D packaging level
Xianfeng Wang, Zhiguo Shi, Kangsheng Chen
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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System level drop reliability method research for netbook memory module
Minyi Lou, Jianwei Zhou, Long Wen, Weiwei Feng, Jaisung Lee
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Effects of bump metallurgies, underfill material and its cure process on package warpage
Jieping Zhang, Dongwen Gan, Jinlin Wang, Saikumar, Jayaraman, Li-Hsin Chang
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Study on properties of low-Ag content Sn-Ag-Zn lead-free solders
Tingbi Luo, Xi Chen, Jing Hu, Anmin Hu, Ming Li
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Design for reliability - a Reliability Engineering Framework
Caers, J F J M, Zhao, X J, Mooren, J, Stulens, L, Eggink, E
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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A new tool development for the thermal design and quick performance evaluation of FBGA devices
Siew Hoon Ore, Zhu, W H, Yuan, W L, Suthiwongsunthorn, Nathapong
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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The effects of response features on failure modes of board level drop impact test
Liu, Y, Sun, F L, Kessels, F J H D, van Driel, W D, Zhang, G Q
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Failure strength study of silicon die and LCD glass by FEA and experiment
Hu, Billy, Cai, Charles, Dongji Xie, Boyi Wu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Interface toughness characterization in microelectronic packages based on four point bending test and simulation
Ma Ya-hui, Ma Xiao-song, Zhou Peng, Hai Yang, You Zhi, Liu Dong-Jing
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Design-for-Reliability applications in concurrent engineering practices for electronic package development from system manufacturers' perspectives
Liyu Yang, Rui Niu, Jingsong Xie, Bin Qian, Baishi Song, Qingan Rong
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Thermal stress characteristics of Cu interconnects using Air-Gap
Lin Xiao-ling, Hou Tong-xian, Zhang Xiao-wen, Yao Ruo-he
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Experimental study on the effect of reflow soldering temperature profile on the solder joint shape
Bo Wang, Xuexia Yang, Yu Zhang, Xuefeng Shu
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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Gapless rework and reliability of lead-free BGA assemblies
Yong-Won Lee, Soon-Min Hong, Young-Joon Moon
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2010)
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Conference Proceeding
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