Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Weerasekera, R., Grange, M., Pamunuwa, D., Tenhunen, H., Li-Rong Zheng
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
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Conference Proceeding
First integration of Cu TSV using die-to-wafer direct bonding and planarization
Leduc, P., Assous, M., Di Cioccio, L., Zussy, M., Signamarcheix, T., Roman, A., Rousseau, M., Verrun, S., Bally, L., Bouchu, D., Cadix, L., Farcy, A., Sillon, N.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
3-D memory organization and performance analysis for multi-processor network-on-chip architecture
Weldezion, A.Y., Zhonghai Lu, Weerasekera, R., Tenhunen, H.
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
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Conference Proceeding
Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh
Grange, M., Weldezion, A.Y., Pamunuwa, D., Weerasekera, R., Zhonghai Lu, Jantsch, A., Shippen, D.
Published in EU-FP7 ELITE-205030 (01.09.2009)
Published in EU-FP7 ELITE-205030 (01.09.2009)
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Conference Proceeding
Electrical modeling of Through Silicon and Package Vias
Bandyopadhyay, T., Chatterjee, R., Daehyun Chung, Swaminathan, M., Tummala, R.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications
Enquist, P., Fountain, G., Petteway, C., Hollingsworth, A., Grady, H.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Impact of 3D design choices on manufacturing cost
Velenis, D., Stucchi, M., Marinissen, E.J., Swinnen, B., Beyne, E.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC
Menglin Tsai, Klooz, A., Leonard, A., Appel, J., Franzon, P.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Architectural evaluation of 3D stacked RRAM caches
Lewis, D.L., Lee, H.-H.S.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
System-level comparison of power delivery design for 2D and 3D ICs
Khan, N.H., Alam, S.M., Hassoun, S.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Thin wafer handling - Study of temporary wafer bonding materials and processes
Hermanowski, J.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs
Khan, N.H., Alam, S.M., Hassoun, S.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits
Cadix, L., Farcy, A., Bermond, C., Fuchs, C., Leduc, P., Rousseau, M., Assous, M., Valentian, A., Roullard, J., Eid, E., Sillon, N., Flechet, B., Ancey, P.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
3D TSV processes and its assembly/packaging technology
Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo, Padmanathan, M., Carson, F.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Toral, G., Temiz, Y., Leblebici, Y.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
Yaoyao Ye, Lian Duan, Jiang Xu, Jin Ouyang, Mo Kwai Hung, Yuan Xie
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)
Van Olmen, J., Coenen, J., Dehaene, W., De Meyer, K., Huyghebaert, C., Jourdain, A., Katti, G., Mercha, A., Rakowski, M., Stucchi, M., Travaly, Y., Beyne, E., Swinnen, B.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Electrical-thermal co-analysis for power delivery networks in 3D system integration
Jianyong Xie, Daehyun Chung, Swaminathan, M., Mcallister, M., Deutsch, A., Lijun Jiang, Rubin, B.J.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Arithmetic unit design using 180nm TSV-based 3D stacking technology
Ouyang, J., Sun, G., Chen, Y., Duan, L., Zhang, T., Xie, Y., Irwin, M.J.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding