Reliability of polyimide-based thin and flexible capacitors with SrTiO3
Ishii, Y., Torn Mori, Shibuya, A., Takemura, K.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Si interposers integrated with SrTiO3 thin film decoupling capacitors and through-Si-vias
Takemura, K., Ohuchi, A., Shibuya, A.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Room temperature wafer bonding using surface activated bonding method
Taniyama, S., Ying-Hui Wang, Fujino, M., Suga, T.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
WLCSP parameter study for ball reliability analysis
Yuan Lin Tzeng, Chen, E., Jeng Yuan Lai, Yu Po Wang, Hsiao, C.S.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Stretchable electronic systems for wearable and textile applications
Loher, T., Vieroth, R., Seckel, M., Ostmann, A., Reichl, H.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Experimental verification and analysis for noise isolation of analog and digital chip-package-PCB hierarchical power distribution network
Hyunjeong Park, Jongjoo Shim, Yujeong Shim, Jeongsik Yoo, Joungho Kim
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
A chip stacking technology utilizing transmission line coupling
Iguchi, D., Akiyama, Y., Ito, T., Otsuka, K.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Prediction of board level reliability of drop test for system-in-package
Get full text
Conference Proceeding
A study on high-speed transmission characteristics of interconnections from PCB to chip
Yamagishi, K., Ishibashi, T., Ohashi, H., Saito, S.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Chip Package Interaction analysis for Cu/Ultra low-k large die Flip Chip Ball Grid Array
Uchibori, C.J., Lee, M., Xeufeng Zhang, Ho, P.S.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
The chip-on-board bonding using non-conductive film and metallic bumps by the surface activated bonding method
Ying-Hui Wang, Tadatomo Suga
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
MPS-C2 and Post Encapsulation Grinding technology for ultra fine pitch and thin die flip chip applications
Orii, Y., Toriyama, K., Oyama, Y., Nishio, T.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Material property calculation of interposer card for modeling of Package-on-Package
Kuzuno, M., Noma, H., Nishio, T.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Applied optimization of black oxide flat heat spreader for low-k molded flip chip packages
Chun-An Huang, Hui Ming Huang, Ho-Yi Tsai, Chiu, S., Huang, C.M.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Enhanced power supply structure with new mesh wiring and electroless plated shunt line and assembly-stress-relaxation structure
Nishio, T., Ishikawa, K., Itoh, F., Itoh, Y., Karatani, C., Koike, K., Ota, Y., Takahashi, M., Hirano, H.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Welcome to IEEE 9th VLSI packaging workshop in Japan (VPWJ2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan
(01.12.2008)
Get full text
Conference Proceeding
Highly reliable silicone TIM for CPU package - Silicone curable grease
Miyoshi, K., Yamada, K., Isobe, K.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding
Analysis of high performance RF integrated passive circuits using the glass substrate
Chen-Chao Wang, Hsueh-An Yang, Ying-Chieh Shyu, Meng-Hsun Li, Chi-Tsung Chiu, Sung-Mao Wu, Chih-Wen Kuo, Chih-Pin Hung
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Get full text
Conference Proceeding