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Modeling of corrugated diaphragms for condenser microphones
Chang-Hung Chen, Heng-Chuan Kan, Po-Hua Yang, Wang Yeng-Tseng
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Thermal management of high power LEDs: Impact of die attach materials
You, J.P., He, Y., Shi, F.G.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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LED package design for high optical efficiency and low viewing angle
Tran, N.T., Shi, F.G.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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Miniaturized WiFi system module using SiP/IPD for handheld device applications
Shih-Ping Liu, Chun-Tai Wang, Chun-Hsien Lee, Wei Wang
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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The performance of various solder ball under high shear speed test
Chau-Jie Zhan, Chun-Chih Chuang, Tao-Chih Chang, Li-Cheng Shen
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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Future lead-free solder alloys and fluxes - meeting challenges of miniaturization
Ning-Cheng Lee
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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A study of board level reliability test with bump structure of WLCSP lead-free solder joints
Kao, F., Zhi Hao Tseng, Chun Sheng Ho, Chen, S., Chang-Yi Lan, Feng Lung Chien
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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Nanopackaging: Nanotechnologies and electronics packaging
Morris, J.E.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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Fast copper plating process for TSV fill
Yun Zhang, Richardson, T., Chung, S., Chen Wang, Bioh Kim
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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POP package (Cavity BGA) warpage improvement and stress characteristic analyses
Wei-Shen Kuo, Yuan Lin Tzeng, Eason Chen, Jeng Yuan Lai, Yu Po Wang, Hsiao, C.S.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
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Shape optimization of micromachined biosensing cantilevers
Kun-Nan Chen, Sun-Po Yu
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders
Chang, C.C., Kao, C.R.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Studies of microvia filling mechanism and a novel Cu plating formula
Wei-Ping Dow, Ming-Yao Yen, Lefebvre, M.J.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding