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Effect of simulation methodology on solder joint crack growth correlation
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Conference Proceeding
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Finite element modeling of BGA packages for life prediction
Gustafsson, G., Guven, I., Kradinov, V., Madenci, E.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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MEMS modular packaging and interfaces
Schuenemann, M., Jam, K.A., Grosser, V., Leutenbauer, R., Bauer, G., Schaefer, W., Reichl, H.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Recent advances on a wafer-level flip chip packaging process
Tong, Q., Ma, B., Zhan, E., Savoca, A., Nguyen, L., Quentin, C., Shijian Luo, Li, H., Fan, L., Wong, C.P.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging
Wong, E.H., Chan, K.C., Rajoo, R., Lim, T.B.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Wafer level CSP using low cost electroless redistribution layer
Teutsch, T., Oppert, T., Zakel, E., Klusmann, E., Meyer, H., Schulz, R., Schulze, J.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Fabrication of a 2D connector for coupling a 4/spl times/8 array of small diameter plastic optical fiber (117/125 /spl mu/m) to RCLED or VCSEL arrays
Coosemaus, T., Van Hove, A., Naessens, K., Vanwassenhove, L., Van Daele, P., Baets, R.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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New CBGA package with improved 2/sup nd/ level reliability
Pendse, R., Afshari, B., Butel, N., Leibovitz, J., Hosoi, Y., Shimada, M., Maeda, K., Maeda, M., Yonekura, H.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect
Qiao, Q., Gordon, M.H., Schmidt, W.F., Li, L., Ang, S.S., Huang, B.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Snap array CSP/sup TM/. Ceramic CSPs for high performance and high reliability applications
Matsuzono, S., Uegaki, S., Sato, S., Matsuda, S., Yanagisawa, M., Wada, H., Ikeda, K., Yoshida, K.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Over-coated flip-chip fine package development for MCM fabricated with Si IC and GaAs MMIC
Kurata, H., Ogata, T., Mitsuka, K., Matsushita, H.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Reliability of flip chip BGA package on organic substrate
Eun-Chul Ahn, Tae-Je Cho, Jong-Bo Shin, Ho-Joong Moon, Ju-Hyun Lyu, Ki-Won Choi, Sa-Yoon Kang, Se-Yong Oh
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Packaging aspects of the Litebus/sup TM/ parallel optoelectronic module
Freitag, L., Kuczynski, J., Fortier, P., Guindon, F., Letourneau, M., Chan, B., Sherman, J., Johnson, G., Demangone, D., Mentzer, M., Naghski, D., Trostle, B.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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Conference Proceeding
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Reliability characterization in Ultra CSP/sup TM/ package development
Yang, H., Elenius, P., Barrett, S., Schneider, C., Leal, J., Moraca, R., Moody, R., Young-Do Kweon, Deok Hoon Kim, Patterson, D., Goodman, T.
Published in 2000 50th Electronic Components and Technology Conference (2000)
Published in 2000 50th Electronic Components and Technology Conference (2000)
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