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Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging
Takahashi, Shintaro, Horiuchi, Kohei, Tatsukoshi, Kentaro, Ono, Motoshi, Imajo, Nobuhiko, Mobely, Tim
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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