Hardware technology for Hitachi M-880 processor group
Kobayashi, F., Watanabe, Y., Yamamoto, M., Anzai, A., Takahashi, A., Daikoku, T., Fujita, T.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Improved thermal conductivity in microelectronic encapsulants
Procter, P., Solc, J.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Crack initiation and growth during low cycle fatigue of Pb-Sn solder joints
Guo, Z., Sprecher, A.F., Conrad, H.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Experimental and analytical investigation of thermally induced warpage for printed wiring boards
Yeh, C.P., Banerjee, K., Martin, T., Umeagukwu, C., Fulton, R., Stafford, J., Wyatt, K.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Z-axis conductive adhesive for TAB and fine pitch interconnects
Chung, K., Dreier, G., Fitzgerald, P., Boyle, A., Lin, M., Sager, J.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Packaging technology for IBM's latest mainframe computers (S/390/ES9000)
Tummala, R.R., Potts, H.R., Ahmed, S.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
A numerical and experimental study of temperature cycle wire bond failure
Chidambaram, N.V.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Positive working photosensitive polymers for semiconductor surface coating
Banba, T., Takeuchi, E., Tokoh, A., Takeda, T.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Qualification and reliability of thermoelectric coolers for use in laser modules
Corser, T.A.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Causes of cracks in SMD and type-specific remedies
Omi, S., Fujita, K., Tsuda, T., Maeda, T.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Energy-based methodology for the fatigue-life prediction of solder materials
Vaymman, S., McKeown, S.A.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding
Flip-chip interconnection technology for advanced thermal conduction modules
Ray, S.K., Beckham, K., Master, R.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Conference Proceeding