by HAUPTMANN, M, STRUYF, H, MERTENS, P, HEYNS, M, DE GENDT, S, GLORIEUX, C, BREMS, S
Published in Ultrasonics sonochemistry (2013)

by Hauptmann, M., Frederickx, F., Struyf, H., Mertens, P., Heyns, M., De Gendt, S., Glorieux, C., Brems, S.
Published in Ultrasonics sonochemistry (01.01.2013)

by Hauptmann, M, Brems, S, Struyf, H, Mertens, P, Heyns, M, De Gendt, S, Glorieux, C
Published in Review of scientific instruments (01.03.2012)

by Belmiloud, N., Tamaddon, A.H., Mertens, P.W., Struyf, H.
Published in Microelectronic engineering (01.02.2014)

by Brems, S., Hauptmann, M., Camerotto, E., Mertens, P.W., Heyns, M., Struyf, H., De Gendt, S.
Published in Ultrasonics (01.02.2014)

by Sioncke, S., Vanherle, W., Art, W., Ceuppens, J., Ivanov, Ts, Lin, D., Nyns, L., Delabie, A., Conard, T., Struyf, H., De Gendt, S., Caymax, M., Collaert, N., Thean, A.
Published in Microelectronic engineering (01.09.2013)

by SIONCKE, S, CEUPPENS, J, LIN, D, NYNS, L, DELABIE, A, STRUYF, H, DE GENDT, S, MÜLLER, M, BECKHOFF, B, CAYMAX, M
Published in Microelectronic engineering (01.07.2011)

by Le, Q.T., Simms, I., Yue, H., Brown, I., Kesters, E., Vereecke, G., Struyf, H., De Gendt, S.
Published in Microelectronic engineering (01.02.2014)

by VEREECKE, G, KESTERS, E, LE, Q. T, CLAES, M, LUX, M, STRUYF, H, CARLEER, R, ADRIAENSENS, P
Published in Microelectronic engineering (01.05.2013)

by Van Aelst, J., Struyf, H., Boullart, W., Vanhaelemeersch, S.
Published in Thin solid films (01.04.2008)

by Kunnen, E., Barkema, G.T., Maes, C., Shamiryan, D., Urbanowicz, A., Struyf, H., Baklanov, M.R.
Published in Microelectronic engineering (01.05.2011)

by Hauptmann, M, Struyf, H, Mertens, P, Heyns, M, Gendt, S De, Glorieux, C, Brems, S
Published in IOP conference series. Materials Science and Engineering (10.12.2012)

by Milenin, A P, de Marneffe, J F, Struyf, H, Boullart, W, Arleo, P
Published in 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.07.2010)

by van der Veen, Marleen H., Maes, J. W., Pedreira, O. Varela, Zhu, C., Tierno, D., Datta, S., Jourdan, N., Decoster, S., Wu, C., Mousa, M., Byun, Y., Struyf, H., Park, S., Tokei, Z.
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)

by van der Veen, Marleen H., Pedreira, O. Varela, Jourdan, N., Park, S., Struyf, H., Tokei, Zs, Cerantes, C. Leal, Chen, F., Xie, X., Wu, Z., Jansen, A., Machillot, J., Cockburn, A.
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)

by Toan Le, Quoc, Whelan, C. M., Struyf, H., Vanhaelemeersch, S., Azioune, A., Louette, P., Pireaux, J.-J., Maex, K.
Published in Journal of applied physics (01.10.2004)

by Gray, W. D., Loboda, M. J., Bremmer, J. N., Struyf, H., Lepage, M., Van Hove, M., Donaton, R. A., Sleeckx, E., Stucchi, M., Lanckmans, F., Gao, T., Boullart, W., Coenegrachts, B., Maenhoudt, M., Vanhaelemeersch, S., Meynen, H., Maex, K.
Published in Journal of the Electrochemical Society (01.07.2003)

by van der Veen, Marleen H., Pedreira, O. Varela, Heylen, N., Jourdan, N., Lariviere, S., Park, S., Struyf, H., Tokei, Zs, Lei, W., Pethe, S., Hwang, S., Chen, F., Wu, Z., Machillot, J., Cockburn, A., Jansen, A.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)

by Tokei, Zs, Vega, V., Murdoch, G., O'Toole, M., Croes, K., Baert, R., Veen, M. Van der, Adelmann, C., Soulie, J. P., Boemmels, J., Wilson, C., Park, S. H., Sankaran, K., Pourtois, G., Sweerts, J., Paolillo, S., Decoster, S., Mao, M., Lazzarino, F., Versluijs, J., Blanco, V., Ercken, M., Kesters, E., Le, Q-T., Holsteyns, F., Heylen, N., Teugels, L., Devriendt, K., Struyf, H., Morin, P., Jourdan, N., Elshocht, S. Van, Ciofi, I., Gupta, A., Zahedmanesh, H., Vanstreels, K., Na, M. H.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)

by van der Veen, Marleen H., Jourdan, N., Gonzalez, V. Vega, Wilson, C. J., Heylen, N., Pedreira, O. Varela, Struyf, H., Croes, K., Bommels, J., Tokei, Zs
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)